CAREER MILESTONES

2007 Will Publish first textbook on SOP technologies, "Introduction to System-on-Package (SOP)"

2007 IEEE David Feldman Award, highest honor by the IEEE-CPMT Society for outstanding contributions in leadership and global impact

2001 Published first packaging textbook, "Fundamentals of Microsystems Packaging"

2000 President of IEEE-CPMT

1998 Distinguished Professor of the Year, Georgia Institute of Technology

1998 Distinguished Alumni of the Year, Indian Institute of Science

1997 Published Microelectronics Packaging Handbook in three volumes: “Technology Drivers,” “System Level Technologies” and “Packaging Technologies”

1997 European Materials Award of the Year, DVM Society

1997 Honorary Visiting Professor, Chinese Academy of Sciences, Fudan University

1997 Total Excellence in Electronics Manufacturing (TEEM) Award, SME

1997 John Jeppson Medallist, ACerS

1996 President of IMAPS

1995 NSF accepts Tummala’s proposal for funding Packaging Research Center

1993 Joined Georgia Institute of Technology, Petit Chair Professor

1993 Technical Achievement Award, IEEE-CHMT

1993 Arthur Friedberg Memorial Lecture, ACerS

1993 David Sarnoff Award, IEEE

1993 Fellow, Institute of Electronic, Electrical Engineers (IEEE)

1992 Engineering Materials Achievement Award, ASM International

1992 John Wagnon Technical Achievement Award, ISHM

1992 Member, National Academy of Engineering

1991 Distinguished Alumni Honor Award, University of Illinois

1984-93 IBM Fellow

1984 Fellow, The American Ceramic Society (ACerS)

1978 Invented and pioneered the first low-temperature ceramic module (63 layers)

1976 Developed first multichip module (35 layers)

1968 Joined IBM Corp.

1968 University of Illinois, Ph.D. in materials science and engineering

1965 Queens University (Canada), M.S. in metallurgical engineering

1963 Indian Institute of Science (Bangalore, India), B.E.

1961 Loyola College (India), B.S. in physics, mathematics and chemistry