Publications & Invited Talks

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2006 <Top>

1. Tummala, R.R., "Moving Next-Generation Electronics beyond Moore's Law," Georgia Institute of Technology Research Horizons magazine, Faculty Column, November 2006, pgs. 24-25.
2. S. K. Bhattacharya, M. Varadarajan, R. Tummala, “A novel electroless plating for embedding thin film resistors on BCB”, Journal of Electronic Materials, accepted.
3. M. Varadarajan, K. Lee, S. K. Bhattacharya, A. Bhattacharjee, L. Wan, R. Pucha, R Tummala, S. Sitaraman, “Studies on Design, Fabrication and Reliability Assessment of Embedded Passives on a High-Density Interconnect (HDI) Organic substrate using a sequential build-up process; Proceedings of the IEEE-CPMT HDP06 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, June 27-30, 2006, Shanghai, pp 98-108.
4. P. Markondeya Raj, Isaac Robin Abothu, Reza Abdolvand, Farrokh Ayazi and Rao Tummala, “Solution-Derived 3D /Vertical Piezoelectric and High Capacitance Density Structures for MEMS and Biomedical Applications”, Advanced Packaging Materials Conference, March 15-17, 2006, p. 122, Atlanta.
5. Gaurav Mehrotra, Rao R. Tummala, P. Markondeya Raj, Ankur Aggarwal, Gaurav Mehrotra, Sau Wee Koh, Shubhra Bansal, Tan Teck, Tiong , CK Ong, Jimmy Chew, Kripesh Vaidyanathan, Vempati Srinivasa Rao, “Copper interconnections for High Performance, Fine Pitch flip chip and Ultra-miniaturized module Applications,” Proceedings, Electronic Components and Technology Conference, 2006, May 28-30, San Diego, pp. 102-111.
6. "ZnO Nanobelt/Nanowire Schottky Diodes Formed by Dielectrophoresis Alignment across Au Electrodes", C.S. Lao, J. Liu, P.X. Gao, L. Zhang, D. Davidovic, R. Tummala and Z.L. Wang Nano Lett., 6 (2006) 263-266.
7. "Quantifying oxygen diffusion in ZnO nanobelt", J. Liu, P.X. Gao, W.J. Mai, C.S. Lao, Z.L. Wang and R. Tummala Appl. Phys. Lett., 89 (2006) 063125.
8. "ZnO nanobelts/wire for electronic detection of enzymatic hydrolysis of starch", Jin Liu; Goud, J.D.; Iyer, M.; Tummala, R.R.; Zhonglin Wang, 2006 11 th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfa (IEEE Cat. No. 06TH8875), 2006, 3 pp.
9. Tummala, R.R., "Moore's Law Meets Its Match," IEEE Spectrum magazine, June 2006.
10. Hideki Sasaki, Vinu Govind, Kishna Srinivasan, Sidharth Dalmia, Venky Sundaram, Madhavan Swaminathan, and Rao Tummala, "Investigation of electromagnetic interference mechanisms for mixed-signal system-on-package (SOP)," the IEICE Transactions, Volume J89-C No.11, Nov. 1, 2006, pp.874-884 (Japanese Paper).
11. "A Novel 20-100µm Pitch IC-to-Package Interconnect and Assembly Process for Pb-Free Solder, Copper or Gold Stud Bumps", Jui-Yun Tsai; Sundaram, V.; Wiedenman, B.; Yangyang Sun; Wong, C.P.; Rao Tummala; Proceedings of the 56th Electronic Components and Technology Conference 2006, May 30 - June 2, 2006 Page(s):263 – 268.
12. "Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration", Sundaram, V. Rao Tummala Wiedenman, B. Fuhan Liu Raj, P.M. Abothu, I.R. Bhattacharya, S. Varadarajan, M. Bongio, E. Sherwood, W. Proceedings of the 56th Electronic Components and Technology Conference 2006, May 30 - June 2, 2006, pp. 1375-1380.
13. Rao Tummala, P. Markondeya Raj, D. Janagama Goud and Mahadevan Iyer, “Nano SOP for Ultra-miniaturized Electronic and Bio-electronic Systems”, SMTA Conference, Hawaii, Jan. 17, 2006, pp. 191-200.
14. Rao R. Tummala, P. Markondeya Raj, Ankur Aggarwal, Gaurav Mehrotra, Sau Wee Koh, Shubhra Bansal, Tan Teck, Tiong, CK Ong, Jimmy Chew, Kripesh Vaidyanathan, Vempati Srinivasa Rao, “Copper interconnections for High Performance, Fine Pitch flipchip and Ultra-miniaturized module Applications”, Proceedings, Electronic Components and Technology Conference, 2006, May 28-30, San Diego, pp. 102-111.
15. P. Markondeya Raj, Isaac Robin Abothu, Reza Abdolvand, Farrokh Ayazi and Rao Tummala, Solution-Derived 3D /Vertical Piezoelectric and High Capacitance Density Structures for MEMS and Biomedical Applications, Accepted for Advanced Packaging Materials Conference, March 15-17, 2006, Atlanta.
16. Baik-Woo Lee, Isaac Robin Abothu, P. Markondeya Raj, Chong K. Yoon and Rao R. Tummala, “Tailoring of Temperature Coefficient of Capacitance ( TCC ) in Nanocomposite Capacitors”, Scripta Materialia, 2006, pp. 1231-1234.
17. Fuhan Liu, Fengtao Wang, Jianjun Yu, Daniel Guidotti, Ali Adibi, Gee-Kung Chang, and Rao Tummala, Matt Moynihan, and Bruno Sicard, Scaleable Board Level High Performance Optical Polymer Waveguide Technologies, 2006 IEE Advanced Packaging Materials conference, March 15-18, Atlanta, GA.
18. Fuhan Liu and Rao Tummala “Future of IC Package Substrate and High Density Interconnect PCB (in Chinese), 2006 China Spring PCB Forum and Show, March 21-24, Shanghai, China.
19. P. Markondeya Raj, Devarajan Balaraman, Isaac Robin Abothu and Rao Tummala, “Achieving Ceramic Properties for Embedding Components in Organic Substrates”, Advance Packaging (Magazine), Vol. 15, Issue 3, March 2006.
20. Isaac Robin Abothu, Baik-Woo Lee, P. Markondeya Raj, Ege Engin, Prathap Muthana, Chong K Yoon, Madhavan Swaminathan and Rao R. Tummala, “Tailoring the Temperature Coefficient of Capacitance ( TCC ), Quality Factor, Dielectric Loss and Capacitance Density with Ceramic-Polymer Nanocomposites for RF Applications”, Proceedings of The 56 th electronic Components and Technology Conference (ECTC), held at San Diego, May 30- June 2, pp. 1790-1794, 2006.
21. Baik-Woo Lee, Jui-Yun Tsai, Hotae Jin, Chong. K. Yoon and Rao. R. Tummala, "New 3D chip stacking SIP technology by wire-on-bump (WOB) and bump-on-flex (BOF)", IEEE, The 56th Electronic Components and Technology Conference, San Diego, California, May 30-June 2, On CD-ROM (2006).
22. Janagama, D Goud, Jin Liu, P.Markondeya Raj, Zhili Hao, Farrokh Ayazi, Iyer K Mahadevan, Rao R. Tummala and Zhonglin Wang. (2006): Surface modification and biofunctionalization of Si microresonators, ZnO nanobelts/wire, and carbon nantubes for fabrication of biosensors. PRC –IAB (2006).
23. Janagama, D.Goud, P. Markondeya Raj, Iyer K Mahadevan, and Rao Tummala: Biofunctionalization of Multi-walled Carbon Nanotubes (MWNTs) for the Fabrication of Protein. Nano Biosensors. IEEE CPMT International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Proceedings (2006).
24. Jin Liu, Janagama, D.Goud, Iyer K.Mahadevan and Rao R.Tummala, and Wang, Z.: ZnONanobelts/wire for Electronic Detection of Enzymatic Hydrolysis of Starch. IEEE CPMT International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Proceedings (2006).
25. S. Bhattacharya, M. Varadarajan, S. Johnston, K. Lee, R. Tummala, S. Sitaraman, J. Papapolymerou, M. Tentzeris, “Embedded Thin Film resistors on BCB by low-cost PWB compatible electroless plating and direct foil lamination transfer processes”, Advanced Packaging Materials: Processes, Properties and Interfaces, Proceedings International Symposium, March 2006, Atlanta, Georgia.

2005 <Top>

26. S. Bhattacharya, M. Varadarajan, P. Chahal, K. Lee, A. Bhattacharjee, R. Tummala, S. Sitaraman, J. Papapolymerou, M. Tentzeris, J. Laskar, “SOP Embedded Thin Film Resistors on High and Low Loss Thick Film Dielectrics”, ASME InterPACK 2005, San Francisco, July, 2005.
27. P. Muthana, M. Swaminathan, R. Tummala, V. Sundaraman, L. Wan, S. Bhattacharya, E. Engin, P. Raj, “Design, modeling, and measurement of embedded decoupling capacitors for power delivery in the mid-frequency”, Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, September, 2005, pp 506-511.
28. K. Lee, R. Pucha, M. Varadarajan, S. Bhattacharya, S. Sitaraman, R. Tummala, “Reliability assessment of embedded capacitors in multi-layered microvia organic substrates”, Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, September 2005, pp 98-104.
29. P. Muthana, M. Swaminathan, E. Engin, P. M. Raj, and R. Tummala, "Mid frequency decoupling using embedded decoupling capacitors, " in Proc. Electrical Performance of Electronic Packaging, Austin, Oct. 2005, pp. 271-274.
30. P. Muthana, M. Swaminathan, R. Tummala, P. Raj, E. Engin, L. Wan, D. Balaraman, and S. Bhattacharya, "Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems, " in IEEE International Symposium on Electromagnetic Compatibility, Chicago, Aug. 2005.
31. Prathap Muthana, Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Lixi Wan, S.K Bhattacharya, P.Markondeya Raj, K.J. Lee, Mahesh Varadarajan, Isaac Robin Abothu, “Measurement, Modeling and Characterization of Embedded Capacitors for Power Delivery in the Mid Frequency Range”, Proceedings, IEEE International Symposium on Electromagnetic Compatibility, August 7-12, Chicago, 2005, pp. 638-643.
32. Lixi Wan, P. Markondeya Raj, M. Swaminathan, and R. Tummala, “Design, Simulation and Measurement Techniques for Embedded Decoupling Capacitors in Multi-GHz Packages/PCBs”, International Conference on Electronic Packaging Technologies, Shanghai, China, August 28-30, 2005, pp. 108-112.
33. Fuhan Liu, Fengtao Wang, Matt Moynihan*, Bruno Sicard*, Nancy Chiarotto, Ali Adibi†, Jianjun Yu†, Gee-Kung Chang†, Rao Tummala, Evaluations of Optical Polymer for System-On-Package Frontiers Optics 2005, The 89th OSA Annual meeting, Laser Science XXI, Optical Society of America, Tucson, October 16-20, Arizona, USA.
34. Fuhan Liu, V. Sundaram, Boyd Wiednman, R.R. Tummala, “Advances in High density Interconnect Substrate and Printed Wiring Board”, Technology Proceedings of the 6th International Conference on Electronic Packaging Technology, 307-313, Shenzhen, China, August 31-September 2, 2005.
35. Rao Tummala, Ankur Aggarwal, Shubhra Bansal and P. Markondeya Raj, “ SMT goes from micro to nanoscale”, Journal of Surface Mount Technology, vol. 18, issue 3, 2005, pp. 19-25.
36. Rao Tummala and P. Markondeya Raj, “ SOP for Multifunctional System Packages through thin Film Component Integration in Contrast to SIP with Stacked IC Modules”, Advanced Packaging (magazine), 2005, August issue, pp. 18-23.
37. Rao Tummala, P. Markondeya Raj, D. Janagaman Goud and Mahadevan Iyer, “ Nano- electronic system materials for electronic and bio electronic applications”, International Conference on Advanced Materials Design & Development, Dec. 14-16, 2005 – Goa, India, pp. 317-321.
38. K. J. Lee, Swapan Bhattacharya, Raghuram Pucha, Lixi Wan, Mahesh Varadarajan, Isaac Robin Abothu, Venky Sundaram, Raj Pulugurtha, Devarajan Balaraman, Madhavan Swaminathan, Rao Tummala and Suresh Sitaraman, “Reliability assessment of embedded passives on multilayered microvia organic substrates”, Paper submitted to the International Symposium and Exhibition on Advanced Packaging Materials, Irvine, CA, March 16-18, 2005.
39. Ankur O. Aggarwal, Shubra Bansal, SauWee Koh, P. Markondeya Raj, Venky Sundaram, Isaac R. Abothu, Michael D. Sacks, Andrew A.O. Tay, Rao R. Tummala, “Reliability Evaluation of Ultra Fine Pitch Reworkable IC- Package Nano Interconnects”, Accepted for 55 th IEEE Electronic Components and Technology Conference, May, 2005, Orlando, Fl..
40. N. Kumbhat, P. Markondeya Raj, R. V. Pucha, R. Doraiswamy, V. Sundaram, S. Bhattacharya, S. K. Sitaraman and R. R. Tummala, “Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications”, Accepted for 55 th IEEE Electronic Components and Technology Conference, May, 2005, Orlando, Fl.
41. Lixi Wan, P. Markondeya Raj, Devarajan Balaraman, Swapan Bhattacharya, Mahesh Varadarajan, Natasha Mittal, Isaac Robin Abothu, Madhavan Swaminathan and Rao Tummala, “ Frequency Limitations of Conventional Embedded Decoupling Capacitors in High Speed Circuits and the Need for Nanocapacitors”, Accepted for 55 th IEEE Electronic Components and Technology Conference, May, 2005, Orlando, Fl.
42. Devarajan Balaraman, P. Markondeya Raj, S. Bhattacharya, Michael Sacks, Michael Lance, Madhavan and Rao Tummala, “Exploring the limits of Low Cost, Organics-compatible High-k ceramic thin-films for embedded decoupling applications”, Accepted for 55 th IEEE Electronic Components and Technology Conference, May, 2005, Orlando, Fl.
43. P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Isaac Robin Abothu, Swapan Bhattacharya, Madhavan Swaminathan and Rao Tummala, “supercapacitive nanocomposite thin films suitable for embedded decoupling capacitors”, Accepted for International Workshop on Integrated Passives, Marco Island, International International Microelectronics and Packaging Society, to be held during January 25-26, 2005.
44. N. Kumbhat, P. M. Raj, R. V. Pucha, S. Atmur, R. Doraiswamy, V. Sundaram, S. Bhattacharya, S. K. Sitaraman and R. R. Tummala, “Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications”, Paper accepted for presentation at Electronic Components and Technology Conference Orlando, FL, to be held during May 31-June 3, 2005.

2004 <Top>

45. P. Markondeya Raj, Steve Atmur, Venky Sundaram, Fuhan Liu, S. Bhattacharya, George White and Rao R. Tummala, "Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging", Accepted for publication, International Journal of Electroceramics.
46. Tummala R.R. and Laskar J., “ Gigabit wireless: system-on-a-package technology”, Proceedings of the IEEE, vol. 92, Issue: 2, pp. 376–387, Feb 2004.
47. S. Banerji, P. Markondeya Raj and Rao R Tummala, "Warpage induced limitation of FR4 and need for alternate materials for microvia and global interconnect needs”, Accepted for IEEE Components Packaging and Manufacturing Technology (CPMT) transactions on advanced packaging, 2004.
48. Shinotani, K.-I., Raj P.M., Seo M., Bansal S., Sakurai H., Bhattacharya S.K. and Tummala R., “ Evaluation of Alternative Materials for System-on-Package (SOP) Substrates”, Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions] , Vol. 27, Issue:4, pp. 694-701, Dec. 2004.
49. Pucha, R.V., Sitaraman S.K., Hegde S., Damani M., Wong C.P., Qu J., Zhang Z., Raj P.M. and Tummala R.R., "Materials and mechanics challenges in SOP-based convergent Microsystems, " Micromaterials and Nanomaterials, A publication series of the Micro Materials Center Berlin at the Fraunhofer Institute IZM, Issue No. 3, pp.16-29. 2004.
50. Nitesh Kumbhat, P. Markondeya Raj, Shashikant Hegde, Raghuram V. Pucha, Venky Sundaram, Susan Hayes, Steve Atmur, Swapan. Bhattacharya, Suresh K. Sitaraman, and Rao R. Tummala, “Novel Board Material Technology for Next-Generation Microelectronic Packaging”, Ceramic Transactions 2004, International Symposium on Electrical Devices & Materials, 104th Annual Meeting of American Ceramic Society, Indianapolis, April 2004.
51. Devarajan Balaraman, P. Markondeya Raj, Lixi Wan, Michael Sacks, Sid Dalmia, Madhavan Swaminathan and Rao Tummala, "BaTiO 3 films by low-temperature hydrothermal techniques for next-generation packaging applications", Accepted for publication in Journal of Electroceramics, (To be published in 2005).
52. Rao Tummala, P. Markondeya Raj and Venky Sundaram, “Next Generation Package and Board Materials”, Advanced Packaging, pp. 26-32, June 2004.
53. Gee-Kung Chang, Guidotti, D., Fuhan Liu, Yin-Jung Chang, Zhaoran Huang, Sundaram, V., Balaraman, D., Hegde, S. and Tummala R.R., ” Chip-to-chip optoelectronics SOP on organic boards or packages”, IEEE Transactions on Advanced Packaging, vol. 27, Issue: 2, pp. 386-397, May 2004.
54. Tay A.A.O., Iyer M.K., Tummala R.R., Kripesh V., Wong E.H., Swaminathan M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang S.S and Kang E.T, “ Next generation of 100-/spl mu/m-pitch wafer-level packaging and assembly for systems-on-package”, IEEE Transactions on Advanced Packaging, vol. 27, Issue: 2, pp. 413-425, May 2004.
55. Sundaram V., Tummala R.R., Fuhan Liu, Kohl P.A., Jun Li, Bidstrup-Allen S.A. and Fukuoka Y., ” Next-generation microvia and global wiring technologies for SOP”, IEEE Transactions on Advanced Packaging, vol. 27, Issue: 2, pp. 315-325. May 2004.
56. Tummala R.R., Swaminathan M., Tentzeris M.M., Laskar J., Gee-Kung Chang, Sitaraman S., Keezer D., Guidotti D., Zhaoran Huang, Kyutae Lim, Lixi Wan, Bhattacharya S., K Sundaram V., Fuhan Liu and Raj P.M., “ The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade”, IEEE Transactions on Advanced Packaging, vol. 27, Issue: 2, pp. 250-267, May 2004.
57. Tummala, R.R., “ SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade”, IEEE Transactions on Advanced Packaging, vol. 27, no 2, pp. 241-249, 2004.
58. Tummala, R.R., “ Introduction to SOP”, IEEE Transactions on Advanced Packaging, vol. 27, no. 2, pp. 239-240, May 2004.
59. Fuhan Liu, Daniel Guidotti, Venky Sundaram, Saru Mahajan, Zhaoran Huang, Y-J Chang, G.K. Chang and Rao R. Tummala, "Material and Process Challenges in Embedding Polymeric Waveguide and Thin Film Detector in Microelectronic Packages", Proceedings of 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, pp. 89-94, March 24-26, 2004.
60. Ankur O. Aggarwal, P. Markondeya Raj, Michael D. Sacks, Andrew A.O. Tay, Rao R. Tummala, Ultra Fine-Pitch Wafer Level Packaging with Reworkable Nano-Interconnects, Proceedings of the 6th Electronic Packaging Technology Conference, EPTC, Singapore, December 9-10, 2004, pp. 132-137.
61. P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Lixi Wan, Robin Abothu, Rosario Gerhardt, Swapan Bhattacharya, Madhavan Swaminathan and Rao Tummala. “High-frequency characteristics of metal-polymer nanocomposite thin films and their suitability for embedded decoupling capacitors”, Proceedings of the 6th Electronic Packaging Technology Conference, EPTC, Singapore, pp. 154-159, December 9-10, 2004.
62. Fuhan Liu, Daniel Guidotti, Zhaoran Huang, G.K. Chang and Rao Tummala, "Interface, Buffer Layer and Opto Integrations on Printed Circuit Board", Proceedings of Optoelectronics Workshop, IMAPS, Bethlehem, PA, pp57-60, October 2004.
63. Ankur O. Aggarwal, P. Markondeya Raj and Rao R. Tummala, “Innovative, Scalable and Reworkable Metal-Polymer Composite Nano Interconnects for Ultra Fine-Pitch Wafer Level Packages”, Proceedings of the International Symposium on Microelectronics, International Microelectronics and Packaging Society, Long Beach, California, November 16-18, 2004.
64. Fuhan Liu, Venky Sundaram and Rao Tummala "Advanced High Density Board Technology for 100 Micron Flip Chip and Wafer Level Packaging", Proceedings of The 37th International Symposium on Microelectronics, International Microelectronics And Packaging Society (IMAPS), Long Beach, CA, Nov.16-18, 2004.
65. Fuhan Liu, Daniel Guidotti, Zhaoran Huang, Fengtao Wang, Ali Adibi, G.K. Chang and Rao R. Tummala, "Build Up Organic Optical Platform for Wide Bandwidth Optical Links", Proceedings of the 37 th International Symposium Microelectronics, International Microelectronics And Packaging Society (IMAPS), Long Beach, CA, Nov.16-18, 2004.
66. Ankur O. Aggarwal, P. Markondeya Raj and Rao R. Tummala, "High aspect ratio metal-polymer composite structures for nanointerconnects ", Proceedings of the 9 th International Symposium on Advanced Packaging Materials, Atlanta, pp. 182-186, March, 2004.
67. Nitesh Kumbhat, Shashikant Hegde, P. Markondeya Raj, Raghuram V. Pucha, Ravi Doraiswami, Susan Hayes, Steve Atmur, Swapan Bhattacharya, Suresh K. Sitaraman, and Rao R. Tummala, “Novel Board Material Technology for Next-Generation Packaging”, IEEE Conference on Advanced Packaging Materials, Atlanta, GA, pp 247-252, March 24–26, 2004.
68. Nitesh Kumbhat, Raghuram V. Pucha, P. Markondeya Raj, Venky Sundaram, Swapan Bhattacharya, Ed Bongio, Steve Atmur, Suresh K. Sitaraman, and Rao R. Tummala, “Development and Evaluation of Low-Cost C-SiC Substrates for High-Density Microvia and Solder-Joint Reliability”, International Microelectronics and Packaging Society, Long Beach, CA, November 14–18, 2004.
69. Ankur Aggarwal, P. Markondeya Raj, Isaac Robin Abothu, Ravi Doraiswami, Michael D. Sacks, Andrew Tay and Rao Tummala, “Material Synthesis Routes for Thin Film Bonding Interfaces in Repairable and Bumpless Nano-Interconnects”, Proceedings of 9 th International Symposium and Exhibition on Advanced Packaging Materials, Atlanta, GA, pp. 69-73, March 24-26, 2004.
70. Devarajan Balaraman, P. Markondeya Raj, Sid Dalmia, Isaac Robin Abothu, Swapan Bhattacharya, Lixi Wan, Michael. D. Sacks, Madhavan Swaminathan and Rao R. Tummala, “Integration of Hydrothermal and Sol-Gel Derived Ceramic Film Capacitors for Next-Generation Convergent Microsystems”, Presented at 106th Annual Meeting and Exposition of The American Ceramic Society held during April 18-21, 2004.
71. Venky Sundaram, Rao Tummala, George White, Kyutae Lim, Lixi Wan, Daniel Guidotti, Fuhan Liu, Swapan Bhattacharya, Raj M. Pulugurtha, Isaac Robin Abothu, Ravi Doraiswami, Raghuram V. Pucha, Suresh Sitaraman, Joy Laskar, Manos Tentzeris, G.K. Chang and Madhavan Swaminathan, “First Single Module Demonstration of SOP with Digital, Optical and RF for Last Mile Broadband Applications”, Proceedings of International Conference on Electronics Packaging, Tokyo, Japan, April 14-16, pp. 399-404, 2004.
72. Shashikant Hegde, Raghuram V.Pucha, Daniel Guidotti, Fuhan Liu, Yin-Jung Chang, Rao Tummala, Gee-Kung Chang and Suresh Sitaraman, “Design, Fabrication, and Reliability Testing of Embedded Optical Interconnects on Package”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 895-900, 2004.
73. Tae-Je Cho, Se-Yong Oh, Sang-Woong Yoon, Joy Laskar and Rao Tummala, “Design of CMOS Voltage Controlled Oscillators Using Package Inductor”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 1682-1686, 2004.
74. Ankur O. Aggarwal, Pulugurtha Markondeya Raj, Kianoush Naeli, Farrokh Ayazi, Swapan Bhattacharya and Rao Tummala, “MEMS Composite Structures for Tunable Capacitors and IC-package Nanointerconnects”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 835-842, 2004.
75. Shubhra Bansal, Ashok Saxena and Rao Tummala “Nanocrystalline Copper and Nickel as Ultra High-Density Chip-to-Package Interconnections”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 1647-1651, 2004.
76. Ankur Aggarwal, Pulugurtha Raj, Isaac Robin Abothu, Michael Sacks, Rao Tummala and Andrew Tay, “New paradigm in IC-Package interconnections by Reworkable Nano-Interconnects”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, pp. 451-462, June 1-4, 2004.
77. Piyush Gupta, Ravi Doraiswami and Rao Tummala, “Effect of Intermetallic compounds on Reliability in Sn-Ag-Cu Flip Chip Solder Interconnects for Different Substrate Pad Finishes and Ni/Cu UBM”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 68-74, 2004.
78. Hideki Sasaki, Vinu Govind, Krishan Srinivasan, Sidharth Dalmia, Venky Sundaram, Madhavan Swaminathan and Rao Tummala, “Electromagnetic Interference (EMI) Issues for Mixed-Signal System-On-Package (SOP)”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp.1437-1442, 2004.
79. Krishna Srinivasan, Madhavan Swaminathan, and Rao Tummala, “Calibration of Near-Field Measurements Using Microstrip Line for Noise Predictions”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp.1432-1436, 2004.
80. Nitesh Kumbhat, P. Markondeya Raj, Raghu Ram V Pucha, Ravi Doraiswami, Swapan Bhattacharya, Susan Hayes, Steve Atmur, Suresh Sitaraman and Rao Tummala, “Next Generation of Package/Board Materials Technology for Ultra-High Density Wiring and Fine-Pitch Reliable Interconnection Assembly”, Proceeding of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 1843-1850, 2004.
81. Sachin Bhatevara, Swapan K Bhattacharya, Gary S. May, Edward W. Kamen, Dean Sutter and Rao Tummala, “Mechatronics Toward Development of A Fully Automated Meniscus Coating System”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 2009-2014, 2004.
82. Isaac Robin Abothu, P. Markondeya Raj, Swapan Bhattacharya, Lixi Wan, Michael Sacks and Rao Tummala, "Low-cost embedded capacitor technology with hydrothermal and sol-gel processes", Proceedings of the 9th International Symposium on Advanced Packaging Materials, Atlanta, pp. 78-83, March, 2004.
83. Isaac Robin Abothu, P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Swapan Bhattacharya, Michael D. Sacks, M. Swaminathan, Michael J. Lance and Rao Tummala, “Development of High-K Embedded capacitors on Printing Wiring Board Using Sol-Gel and Foil Transfer Processes”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp.514-520, 2004.
84. Devarajan Balaraman, Jinwoo Choi, Vijay Patel, P. Markondeya Raj, Isaac Robin Abothu, Swapan Bhattacharya, Lixi Wan, Madhavan Swaminathan and Rao Tummala, “Simultaneous Switching Noise Suppression Using Hydrothermal Barium Titanate Thin-Film Capacitors”, Proceedings of The 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, Nevada, June 1-4, pp. 282-288, 2004.
85. Rao Tummala, P. Markondeya Raj and Z. L. Wang, “Nanoscale packaging and nano-bio electronic systems”, Proceedings of Annual Symposium of the Electrochemical Society, Hawaii, October 4, 2004.
86. Rao Tummala, P. Markondeya Raj and Venky Sundaram, "Microsystems packaging from microscale to microscale to nanoscale", IEEE CPMT International Academic Conference on Next Generation Microsystem Packaging Research and Education, Shanghai, China, June 28-30, 2004.
87. Fuhan Liu, Rao R Tummala, Venky Sundaram, Daniel Guidotti, Zhorn Huang, Y-J Chang, Isaac Robin Abothu, P M Raj, Swapan Bhattacharya, Devarajan Balaraman and G K Chang, “Multifunctional Integrated Substrate Technology for High Density SOP Packaging”, Proceedings of 6 th IEEE CPMT conference on High Density Microsystem Design and Packaging and component Failure Analysis (HDP’04), Bao Long Hotel, Shanghai, China, June 30-July, pp. 83-90, 2004.
88. N. Kumbhat, P.M. Raj, S. Bansal, R. Doraiswami, S. Bhattacharya and R Tummala, “New Package/Board Materials Technology for Next Generation Convergent Electronic Systems, ” Proceedings of the Electronic Packaging Technology Conference, vol. 5, pp. 331-335, December 2003.
89. Tummala R.R., Markondeya Raj P. and Sundaram V., “ Microsystems packaging from milli to microscale to nanoscale”, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04), 30 June-3 July, pp: 1–7, 2004.
90. Setia R., May G.S., Sundaram V and Tummala R.R., “ Sensitivity analysis and optimization of excimer laser ablation for microvia formation using neural networks and genetic algorithms”, Proceedings of the 29th International Electronics Manufacturing Technology Symposium, IEEE/CPMT/ SEMI, pp: 131–139, July 14-16, 2004.
91. Kim W., Madhavan R., Mao J., Choi J., Choi S., Ravi D., Sundaram V., Sankararaman S., Gupta P., Zhang Z., Lo G., Swaminathan M., Tummala R., Sitaraman S., Wong C.P., Iyer M., Rotaru M. and Tay A., “ Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission ”, Proceedings of Electronic Components and Technology Conference 2004, vol. 2, pp.1506–1512, June 2004.
92. Lim K., Wan L., Guidotti D., Sundaram V., White G., Liu F., Bhattacharya S., Doraiswami R., Chang Y.-J., Yu J., Sarkar S., Pratap R., Yoon S.-W., Maeng M., Pinel S., Laskar J., Tentzeris M., Chang G.K., Swaminathan M. and Tummala R., System-on-a-package (SOP) module development for a digital, RF and optical mixed signal integrated system ”, Proceedings of Electronic Components and Technology Conference 2004, vol. 2, pp.1693–1697, June 2004.
93. Mahalingam, S., Hegde S., Ahmad J., Pucha R.V., Sundaram V., Fuhan Liu, White G., Tummala R. andSitaraman S.K., “ Materials, processes and reliability of mixed-signal substrates for SOP technology”, Proceedings of Electronic Components and Technology Conference 2004, vol. 2, pp: 1630–1635, June 2004.
94. Sasaki H., Govind V., Srinivasan K., Dalmia S., Sundaram V., Swaminathan M., Tummala R, “Electromagnetic interference (EMI) issues for mixed-signal system-on-package (SOP)”, Proceedings of Electronic Components and Technology Conference 2004, vol. 2, pp. 1437–1442, June 2004.
95. Sundaram V., Tummala R., White G., Lim K., Lixi Wan, Guidotti, D., Fuhan Liu, Bhattacharya, S.; Pulugurtha R.M., Abothu I R., Doraiswami R., Pucha R.V., Laskar J., Tentzeris M., Chang G.K., Swaminathan M., “ System-on-a-package (SOP) substrate and module with digital, RF and optical integration ”, Proceedings of Electronic Components and Technology Conference 2004, Las Vegas, vol. 1, pp.17–23, June 2004.

2003 <Top>

96. Bhattacharya, S.K., Moon K.S., Tummala R.R., May, G.S., “ Meniscus coating: a low-cost polymer deposition method for system-on-package (SOP) substrates Electronics Packaging Manufacturing”, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part C: Manufacturing, IEEE Transactions on], vol. 26, Issue. 2, pp.110-114 April 2003.
97. S. K. Bhattacharya, R. Doraiswami, L. Conrad, G. May and R Tummala, “The Development and Implementation of a Hands-on, Multidisciplinary Product, ” World Transactions on Engineering and Technology Education, vol. 2, No. 3, pp. 407-410, 2003.
98. S. Bhattacharya, P. M. Raj, D. Balaraman, H. Windlass and R Tummala, “Process Development for PWB Compatible Embedded Capacitors, ” Circuit World, vol. 30, No. 1, pp. 31-35, 2003.
99. H. Windlass, P. M. Raj, D. Balaraman, S. K Bhattacharya and R Tummala, “Polymer Ceramic Nanocomposite Capacitors for System-On-Package Applications, ” IEEE Transactions of Advanced Packaging, volume 26, number 1, pp. 10-16, 2003.
100. H. Windlass, P. M. Raj, D. Balaraman, S. K. Bhattacharya and R Tummala, “Colloidal Processing of Polymer Ceramic Nanocomposites for Integral Capacitors”, IEEE Transactions on Electronics Packaging Manufacturing, vol. 26, pp. 100-105, April 2003.
101. Nitesh Kumbhat, P. Markondeya Raj, Shubhra Bansal, Ravi Doraiswami, S. Bhattacharya and Rao Tummala, “New Package/Board Materials Technology for Next-Generation Convergent Microsystems”, Electronic Packaging Technology Conference, Singapore, pp. 331-335, December 10–12, 2003.
102. Nitesh Kumbhat, P. Markondeya Raj, S. Bansal, R. Doraiswami, Swapan Bhattacharya, Rao Tummala, Susan Hayes and Steve Atmur, "New package/board materials technology for next generation convergent electronic systems", Proceedings - Electronic Packaging and Packaging Technology Conference, Singapore, pp. 331-335, December 10-12, 2003.
103. Ankur O. Aggarwal, I R Abothu, P. Markondeya Raj, M. D. Sacks and Rao R. Tummala, "Novel Low-Cost Sol-Gel Derived Nano-structured and Repairable Interconnects", Proceedings, International Microelectronics and Packaging Society, 2003, Boston, MA, pp. 943-948, November, 2003.
104. Devarajan Balaraman, P. Markondeya Raj, Lixi Wan, Michael Sacks, Sid Dalmia, Madhavan Swaminathan and Rao Tummala, "BaTiO 3 films by low-temperature hydrothermal techniques for next-generation packaging applications", Proceedings of the International Conference on Electroceramics, MIT, Cambridge, August 4-6, 2003.
105. Sundaram V., Fuhan Liu, Aggarwal, A.O., Hosseini S.M., Mekala S., White G.E., Tummala R.R., Swaminathan M., Woopoung Kim, Madhavan R., Lo G., Iyer M.K., Vaidyanathan K., Ee Hua Wong, Ranjan Rajoo and Chong C.T, “ Ultra-high density board technology for sub-100 /spl mu/m pitch nano-wafer level packaging”, Proceedings of the 5 th Electronics Packaging Technology Conference (EPTC 2003), pp: 125–129, Dec10-12, 2003.
106. Rao Tummala, “Changing Role of IC and Systems Packaging: SOC vs. SOP/SIP, ” IEEE Workshop on Signal Propagation on Interconnects, Siena, Italy, May 2003.
107. A.O. Aggarwal, I.R. Abothu, P.M. Raj and M.D. Sacks, “Sol-Gel Derived and Repairable Interconnects, ” Proceedings of the Electronic Packaging Technology Conference, Singapore, pp. 385-389, December 10-12, 2003.
108. D. Balaraman, P.M. Raj, S. Bhattacharya, I. Abothu, S. Dalmia, L. Wan and M. Swaminathan, “Synthesis of Ceramic Thin Films for Organic Board Compatible Integral Capacitors - Processing and Characterization”, Proceedings of the International Microelectronics and Packaging Society, pp. 200-206, November 2003.
109. K. Brownlee, P. M. Raj, K. Shinotani and S. Bhattacharya, “Evaluation of Low-stress Dielectrics for Board Applications, ” Proceedings of the 53 rd Electronic Components and Technology Conference, pp. 136-141, May 2003.
110. S. Bansal, P. M. Raj, S. Bhattacharya and M. Lanec, “In-situ Stress and Warpage Measurement to Investigate Reliability of Flip Chip On-Board Assembly Without Underfill, ” Proceedings of the 53 rd Electronic Components and Technology Conference, pp. 148-155, 2003.
111. D. Balaraman, P. M. Raj and S Bhattacharya, “Integration and High Frequency Characterization of PWB Compatible Barium Titanate Films Synthesized by Modified Hydrothermal Techniques”, Proceedings of the Electronic Components and Technology Conference, pp. 1520-1527, 2003.
112. F. Liu, V. Sundaram, G. White, A.O. Aggarwal and D. Sutter, “Micro-Board Technology Development at the Packaging Research Center, ” Proceedings of the International Conference of Electronic Packaging, pp. 187-192, April 2003.
113. F. Liu, G. White, V. Sundaram, A.O. Aggarwal, S.M. Hossini and D. Sutter, “A Novel Technology for Stacking Microvias on Printed Circuit Boards”, Proceedings of the 53 rd Electronic Components and Technology Conference, pp. 1134-1139, May 2003.
114. D. Guidotti, F. Liu, V. Sundaram, N.M. Jokerst, J.D. Hall, T. Mule, S. Sitaraman, S. Hedge and G. White, “Embedded Optical Interconnects in Printed Circuit Boards, ” Proceedings of IMAPS - Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS) Workshop, pp. 9-12, October 2003.
115. R. Doraiswami, S. Sankararaman, W. Kim, J. Li, Z. Zhang, P. Gupta, K. Nakanishi, M. Borkar, R. Madhavan, V. Govind, S. Choi, A.O. Aggarwal, Y. Sun. L. Fan, V. Sundaram, M. Swaminathan and C.P. Wong, “Advances in Fine Pitch Lead Free Assembly Process, ” Proceedings of the 53 rd Electronic Components and Technology Conference, pp. 834-839, 2003.
116. V. Sundaram, F.H. Liu, A.O. Aggarwal, S.M. Hosseini, S. Mekala, G.E. White, M.K. Iyer, K. Vaidyanathan, E.H. Wong, R. Rajoo, T.C. Chong, M. Swaminathan, W. Kim, R. Madhavan and G. Lo., “Ultra-High Density Board Technology for Sub-100um Pitch Nano Wafer Level Packaging, ” Proceedings of the 5 th Electronics Packaging Technology Conference, pp. 125-129, December 2003.
117. K. Lim, M.F. Davis, M. Maeng, S. Pinel, L, Wan, J. Laskar, V. Sundaram, G. White and M. Swaminathan, “Intelligent Network Communicator: Highly Integrated System-on-Package (SOP) Testbed for RF/Digital/Opto Applications, ” Proceedings of the 53 rd Electronic Components and Technology Conference, pp. 1594-1598, 2003.
118. B. Zhao, A. Tay, Z.Q. Zhang, C.P. Wong and D. Ravi, “Fatigue Life Prediction of Ultra-Fine Pitch Flip Chip Solder Joint with Underfill”, Proceedings of the 5th Electronic Packaging Technology Conference, pp. 683-686, December 2003 .
119. K. Lim, M.F. Davis, M. Maeng, S.W. Yoon, S. Pinel, L. Wan, D., Guidotti, D. Ravi, J. Laskar, E. Tentzeris, V. Sundaram, G. White, M. Swaminathan, M. Brook and N. Jokerst, “Development of Intelligent Network Communicator for the Mixed Signal Communications Using the System-on-a-Package (SOP) Technology, ” 2003 Asia-Pacific Microwave Conference Digest, pp. 1003-1006, 2003.
120. W. Kim, R. Madhavan, J. Mao, J. Choi, S. Choi, D. Ravi, V. Sundaram, C.P. Wong, M. Iyer, M. Rotaru and A. Tay, “Electrical Design of Wafer Level Package on Board for Gigabit Data Transmission, ” Proceedings of the 5th Electronic Packaging Technology Conference, pp. 150-159, December 2003.

2002 <Top>

121. S. Bhattacharya and R Tummala, “Epoxy Nanocomposite Capacitors for Application as MCM -L Compatible Integral Passives, ” ASME Journal of Electronic Packaging, vol. 124, pp 1-6, 2002.
122. J. Wu, S. Bhattacharya, C. Lloyd, R. Tummala, C.P. Wong and H. Pogge, "Development of High-performance Interfill Materials for System Chips Technology”, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, pp 217-223, June 2002.
123. M.F.Davis, A.Sutono, S.-W.Yoon, S.Mandal, N.Bushyager, C.-H.Lee, L.Lim, S.Pinel, M.Maeng, A.Obatoyinbo, S.Chakraborty, J.Laskar, M.Tentzeris, T.Nonaka and R.R.Tummala, “Integrated RF Architectures in Fully-Organic SOP Technology, ” IEEE Transactions on Advanced Packaging, vol.25, No.2, pp.136-142, May 2002.
124. Fuhan Liu, Jicun Lu, Venky Sundaram, George White, Dean Sutter, Daniel Baldwin and Rao R. Tummala, “Reliability Assessment of Microvias in HDI Printed Circuit Boards, ” IEEE-Transactions on Components And Packaging Technologies, vol., 25 No.2, pp. 254-259, June 2002.
125. K.Lim, S.Pinel, M.Davis, A.Sutono, C.-H.Lee, D.Heo, A.Obateyinbo, J.Laskar, E.M.Tentzeris, R.Tummala, "RF-System-On-Package (SOP) for Wireless Communications, ” IEEE Microwave Magazine, Vol.3, No.1, pp.88-99, March 2002.
126. Rao Tummala, “US Approach to R&D: A New Model for the 21 st Century, ” IMAPS Nordic, Stockholm, Sweden, September 2002.
127. Rao Tummala, “Nanomanufacturing for System Paradigms Around 2010 and Beyond – A Proposal for NEMI Partnership, ” NEMI, Montreal, Canada, September 2002.
128. Rao R. Tummala, Venky Sundaram, Fuhan Liu, George White, Swapan Bhattacharya, Raj M. Pulugurtha, Madhavan Swaminathan, Sidharth Dalmia, Joy Laskar, Nan Marie Jokerst and Sang Yeon Chow, "High Density Packaging in 2010 and Beyond", Proceedings of the 4th International Symposium on Electronic Materials And Packaging (EMAP 2002), Taiwan, pp. 1-10, Dec. 4-6, 2002.
129. Rao Tummala, “Nano Bio-Electronics Systems Manufacturing Processes for Personal Health Care and Safety”, General Electric, New York, October 2002.
130. M. Swaminathan and Rao Tummala, “System-on-a-Package Technologies for Enabling Future Microsystems”, Keynote Talk, Signal Propagation on Interconnects Workshop, Pisa, Italy, May 2002.
131. Rao Tummala, Madhavan Swaminathan, Venky Sundaram, Fuhan Liu, Sidharth Dalmia, Joseph Hobbs, Erdem Matoglu, George E. White, Joy Laskar and Nan-Marie Jokerst, “The Status and Challenges in SOC, SIP and SOP Emerging Technologies, ” Semi Technology Symposium ( STS ), SEMICON Japan 2002, December 3-6, 2002.
132. Rao Tummala, Venky Sundaram, Fuhan Liu, Sidharth Dalmia, Joseph Hobbs, Erdem Matoglu, George E. White, Joy Laskar, Madhavan Swaminathan and Nan-Marie Jokerst, " SOC, SIP, and SOP: The Pros and Consfor Next-Generation Convergent Systems, ” IMAPS Nordic Conference, Stockholm, Sweden, Sep 29 - Oct 2, 2002.
133. K. Brownlee, K. Shinotani S. K. Bhattacharya and R. R. Tummala, “ Evaluation of liquid crystal polymers for high performance SOP application”, Proceedings of the 52nd Electronic Components and Technology Conference, San Diego, CA. pp. 676– 680, May 28-31, 2002.
134. S. Bansal, P. Markondeya Raj, S. Banerji, K. Shinotani, M. J. Lance, S. Bhattacharya and R. Tummala, “Assessment of Microsystems by Direct Measurement of Stresses using Raman Spectroscopy”, Presented at 4 th International Electronic Packaging and Technology Conference, Singapore, December 10-12, 2002.
135. Fuhan Liu, Venky Sundaram, Dean Sutter, George White and Rao Tummala, “Fabrication of Super Fine Structure Circuits on Build-Up Substrates”, Proceedings of 52nd IEEE-ECTC, San Diego, CA, pp. 1425-1431, May 28-31, 2002.
136. D. Balaraman, P. Markondeya Raj, S. K. Bhattacharya and R. R. Tummala, “Novel Hydrothermal Processing of Ceramic-polymer Composites for Integral Capacitor Applications, ” Presented at IMAPS 2002, International symposium on packaging materials, processes and interfaces, Stone Mountain, Georgia, March 3-5, 2002.
137. Devarajan Balaraman, P. Markondeya Raj, Ravindra Tanikella, Swapan Bhattacharya, Paul Kohl, and Rao Tummala, “Low Temperature Synthesis (100°C) Hydrothermal Synthesis of High-K Low Loss BaTiO 3 Films for Integral Capacitors”, 4 th International Electronic Packaging and Technology Conference, Singapore, pp. 79-84, December 10-12, 2002.
138. S. Bansal, P. Markondeya Raj, S. Banerji, K. Shinotani, M. J. Lance, S. Bhattacharya and R. Tummala, “Reliability Assessment of High Density Multilayered Board Using Shadow Moire and Luminescence Spectroscopy, ” 4 th International Electronic Packaging and Technology Conference, Singapore, pp. 126-132, December 10-12, 2002.
139. A. O. Agarwal, P. Markondeya Raj, R. J. Pratap, A. A. Saxena and R. R. Tummala, “Design and Fabrication of High Aspect Ratio Interconnects with Optimal Electrical and Mechanical Performance of Nanowafer Level Packaging”, 4 th International Electronic Packaging and Technology Conference, Singapore, pp. 229-234, December 10-12, 2002.
140. K. Brownlee, K. Shinotani S. K. Bhattacharya and R. R. Tummala, “Evaluation of Liquid Crystal Polymers for Advanced SOP Applications, ” Proceedings, Electronic Components and Technology Conference, San Diego, CA, pp. 676-680, May 28-31, 2002.
141. S. Banerji, P. Markondeya Raj, F. Liu, S. K. Bhattacharya, K. Shinotani and R. Tummala, “The Role of Stiff Substrates in Warpage Reduction for Future High Density Wiring Requirements”, International symposium on packaging materials, processes and interfaces, pp. 221-225, Stone Mountain, Georgia, 2002.
142. D. Balaraman, P. Markondeya Raj, S. K. Bhattacharya, and R. R. Tummala, “Novel Hydrothermal Processing of Ceramic-polymer Composites for Integral Capacitor Applications”, Proceedings, Electronic Components and Technology Conference, San Diego, CA, pp. 1699-1703, May 28-31, 2002.
143. S. Bhattacharya, S. Dalmia, D. Balaraman, P. M. Raj, F. Ayazi, M. Swaminathan and R. Tummala, “Fabrication and RF Characterization of Embedded High Q Inductors and Capacitors on Organic Laminates for System-on-Package (SOP) Application”, Proceedings of the Advanced Technology Workshop on Passive Integration, Ogniguit, ME, June, 2002.
144. K. Brownlee, S. Bhattacharya, K. S. Shinotani, C. P. Wong and R. Tummala, “Liquid Crystal Polymers for High Performance SOP Application, ” IEEE 8 th International Advanced Packaging Materials Conference, Stone Mountain, Georgia, pp 249-253, March 2002.
145. S. Banerji, P. M. Raj, F. Liu, K. Shinotani, S. Bhattacharya and R. Tummala, “The Role of Stiff Base Substrates in Warpage Reduction for Future High Density Wiring Requirements, ” IEEE 8 th International Advanced Packaging Materials Conference, Stone Mountain, Georgia, pp 221-225, March 2002.
146. R. Tummala, S. Dalmia, D. Balaraman, J. Hobbs, H. Windlass, A. Bavisi, P. M. Raj, S. H. Lee, S. Bhattacharya, G. White, F. Ayazi, M. Swaminathan, A. Erbil and T. Ogawa “Recent Advances in Integral Passives Research at Georgia Tech”, International Conference on Electronic Packaging, Tokyo, Japan, pp 116-123, April 2002.
147. S. Lee, S. Min, S. Kim, S. Dalmia, V. Sundaraman, S. Bhattacharya, G. White, F. Ayazi, J. Kenney, M. Swaminathan and R. Tummala, “High Performance Spiral Inductors Embedded on Organic Substrates for SOP Applications, ” Proceedings of the 2002 IEEE MTT-S International Microwave Symposium (IMS 2002), Seattle, WA, pp 2229-2232, June 2002.
148. R. Doraiswami, J. Li, S. Bhattacharya, L. Conrad, G. May and R. Tummala, “Hands-on Module Packaging Education at Georgia Tech, ” Proceedings of the 52 nd Electronic Components and Technology Conference, San Diego, pp 1517-1523, May, 2002.
149. K. Brownlee, P. M. Raj, S. Bhattacharya, K. Shinotani, R. Tummala and C. P. Wong, “Liquid Crystal Polymers for High Performance System-on-Package Substrate, ” Proceedings of the 52 nd Electronic Components and Technology Conference, San Diego, pp 676-680, May, 2002.
150. D. Balaraman, P. M. Raj, R. Tanikella, P. Kohl, S. Bhattacharya and R. Tummala, “Novel Hydrothermal Processing (<100 oC) of Ceramic-polymer Composites for Integral Capacitor Applications, ” 52 nd Electronic Components and Technology Conference, San Diego, pp 1699-1703, May, 2002.
151. S. Bansal, P. M. Raj, S. Banerji, K. Shinotani, S. Bhattacharya, R. Tummala, and M. J. Lance, “Reliability Assessment of High Density Multi-layer Board Assembly by Shadow Moire and Luminescence Spectroscopy”, 4 th Electronics Packaging Technology Conference (EPTC), Singapore, December, 2002.
152. L. Wan, M. Swaminathan and R. R. Tummala, “Simulation of Switching Noise in Multi-layer Structures using the Generalized Transmission Line Equation Method, ” Proceedings of the International Symposium on Electromagnetic Compatibility, vol. 2, pp. 1026-1031, Minneapolis, MN, August 2002.
153. J. M. Hobbs, S. Dalmia, V. Sundaram, L. Wan, W. Kim, G. White, M. Swaminathan and R. R. Tummala, “Development and Characterization of Embedded Thin-Film Capacitors for Mixed Signal Applications on Fully Organic System-on-package Technology”, Proceedings of Radio and Wireless Conference, pp. 201-204, 2002.
154. J.Laskar, M.Tentzeris, K.Lim, S.Pinel, M.Davis, A.Rhagavan, M.Maeng, S.W.Yoon and R.Tummala, “Advanced System-on-Package RF Front-ends for Emerging Wireless Communications”, Proceedings of the 2002 Asian-Pacific Microwave Symposium, pp. III.1703-1708, Kyoto, JAPAN, November 2002.
155. M.F.Davis, S.-W.Yoon, S.Mandal, N.Bushyager, M.Maeng, K.Lim, S.Pinel, A.Sutono, J.Laskar, M.Tentzeris, T.Nonaka, V.Sundaram, F.Liu and R.Tummala, “RF/Microwave Multiband Design Solutions for Multilayer Organic System-on-Package Integrated Passives, ” Proceedings of the 2002 IEEE International Microwave Symposium, pp. III. 2217-2220, Seattle, WA, June 2002.
156. Fuhan Liu, Venky Sundaram, Ankur O. Aggarwal, Dean Sutter, George White and Rao R. Tummala, “Ultra-High Density PCB Technology for Next Generation Nano-IC Packages, ” Proceedings of 5th High-Density Packaging Conference, Shanghai, China, pp. 145-150, June 30-July 3, 2002.
157. S.H. Lee, S. Min, D. Kim, S. Dalmia, W. Kim, V. Sudnaram, S. Bhattacharya, G. White, F. Ayazi, J. S. Kenney, M. Swaminathan, and R. R. Tummala, “High Performance Spiral Inductors Embedded on Organic Substrates for SOP Application”, Proceedings of the 2002 IEEE-IMS Symposium, Seattle, WA, pp.2229-2232, June 2002.
158. M.F.Davis, S.-W.Yoon, S.Mandal, N.Bushyager, M.Maeng, K.Lim, S.Pinel, A.Sutono, J.Laskar, M.Tentzeris, T.Nonaka, V.Sundaram, F.Liu and R.Tummala, “RF-Microwave Multi-band Design Solutions for Multilayer Organic System on Package Integrated Passives”, Proceedings of the 2002 IEEE-IMS Symposium, Seattle, WA, pp.2217-2220, June 2002.
159. S. Dalmia, F. Ayazi, M. Swaminathan, S.H. Min, S.H. Lee, W. Kim, D.S. Kim, S. Bhattacharya, V. Sundaram, G. White and R. Tummala, “Design of Inductors in Organic Substrates For 1-3 GHz Wireless Application”, Dig. 2002 IEEE MTT-S International Microwave Symposium (IMS 2002), Seattle, WA, pp. 1405-1408, June 2002.
160. Venky Sundaram, Fuhan Liu, Sidharth Dalmia, Joseph Hobbs, Erdem Matoglu, Mekita Davis, Toshihisa Nonaka, Joy Laskar, Madhavan Swaminathan, George E. White, and Rao R. Tummala, “Digital and RF Integration in System-on-a-Package (SOP), ” Proceedings of the 52nd Electronic Components and Technology Conference, 2002, pp. 646– 650, 28-31 May 2002.
161. Rao R. Tummala, Venky Sundaram, Fuhan Liu, Sidharth Dalmia, Joseph Hobbs, Erdem Matoglu, Mekita Davis, George E. White, Joy Laskar, Madhavan Swaminathan, Nan-Marie Jokerst, and Toshihisa Nonaka, "Digital, RF and Optical Integration in System-on-a-Package (SOP) for Convergent Systems”, International Conference on Electronic Packaging, ICEP 2002, Tokyo, Japan, April 17-19, 2002.
162. D. Balaraman, P. M. Raj, S. Bhattacharya and R. Tummala “Low Temperature Hydrothermal Synthesis of High-k Low Loss Barium Titanate Films for Integral Capacitors, ” Proceedings of 4 th Electronics Packaging Technology Conference, Singapore, December, 2002.

2001 <Top>

163. Prof. Rao R. Tummala, Mahesh Varadarajan, Prof. Zsolt Illyefalvi-Vitez, Dr. Joachim Zimmermann, “Fundamentals of System-Level PWB Technologies”, Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, pp. 612-656.
164. Prof. Rao R. Tummala, Prof. Joy Laskar, Prof. Emmanouil M. Tentzeris, Prof. Jose E. Schutt-Aine, “Fundamentals of RF Packaging”, Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, pp. 500-540.
165. Prof. Rao Tummala, Dr. Phil Garrou, “Fundamentals of Wafer-Level Packaging” - Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, pp. 398-417.
166. Prof. Rao R. Tummala, Prof. Harry K. Charles Jr., “Fundamentals of Multichip Packaging”, Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, pp. 296-338.
167. Prof. Rao R. Tummala, Dr. Sundar M. Kamath, “Fundamentals of Single Chip Packaging”, Fundamentals of Microsystems Packagin g, McGraw-Hill, 2001, pp. 264-293.
168. Prof. Rao Tummala, Dr. Bob Hubbard, Evan Davidson, Prof. N.J. Rao, Dr. D.H.R. Sarma, “The Role of Packaging in Microsystems”, Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, pp. 80-119.
169. Rao R. Tummala, Prof. James E. Morris, “The Role of Packaging in Microelectronics” Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, pp. 44-79.
170. Rao R. Tummala, “Introduction to Microsystems Packaging”, Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, pp. 2-42.
171. S. Bhattacharya, S. Bhatevara, D. Sutter, E. Kamen and R Tummala, “An Automated Workcell for Meniscus Coating on Large Area Packaging Substrates, " IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 4, pp. 625-630, December 2001.
172. R Tummala, “ Ceramics in Information Technology, ” International Symposium on Advanced Ceramics, Hyderabad, India, January 2001.
173. S. Bhattacharya and R Tummala, "Integral Passives for Next Generation of Electronic Packaging: Application of Epoxy/Ceramic Nanocomposites as Integral Capacitors”, Microelectronics Journal, vol. 32, no. 1, pp. 11-19, 2001.
174. M.F. Davis, A. Sutono, A. Obatoyinbo, S. Chakraborty, K. Lim, S. Pinel, J. Laskar, S.H. Lee and R Tummala, “Integrated RF Function Architectures in Fully-organic SOP Technology”, IEEE-EPEP, vol.43, pp. 93-96, 2001.
175. S. Bhattacharya, P. Raj, K. Shinotani, K. Moon, G. May and Rao Tummala, “An Alternative Method for Thin Film Polymer Coating on Large Area SOP Substrates, " ASME Interpack, Kauai, HI, July 2001.
176. Rao R Tummala, “ SOC + SOP: Commercial Systems Beyond 2007”, presented at the IEEE/CPMT Chapter Meeting, Phoenix, AZ, November 2001.
177. Rao R Tummala, “SOP vs. SOC : Which is the Technology of the Future?”, keynote address, 2001 KGD Packaging and Test Workshop, Napa Valley, CA, September 2001.
178. S. Bhattacharya, S. Sitaraman, I. C. Ume, D. Baldwin, C. P. Wong, J. Qu and Rao R Tummala, “Large Area Processing Using Small Area Substrates: A Low Cost MCM -D Processing”, ASME Interpack, Kauai, HI, July 2001.
179. F. Liu, J. Lu, V. Sundaram, D. Sutter, G. White, D. Baldwin and Rao R Tummala, “Reliability Assessment of Microvias in HDI Printed Circuit Boards, ” Proceedings of the 51 st Electronic Components & Technology Conference, pp. 1159-1163, Orlando, FL, May/June 2001.
180. S. Dalmia, S. Min, W. Kim, M. Swaminathan, V. Sundaram, F. Liu, G. White and Rao R Tummala “Design of Embedded High-Q Inductors in MCM -L Technology, ” Proceedings of IMS 2001 Conference, May 2001.
181. J. Hobbs, H. Windlass, V. Sundaram, S. Chun, M. Swaminathan and Rao R Tummala, " Simultaneous Switching Noise Suppression for High Speed Systems Using Embedded Decoupling, ” Proceedings of the 51 st ECTC Conference, Orlando, FL, May 2001.
182. H. Windlass, P. Markondeya Raj, D. Balaraman, S. K. Bhattacharya and R. R. Tummala, “Development and integration of polymer ceramic nanocomposite dielectrics in system on package”, Proceedings of 51 st Electronic Components and Technology Conference, Orlando, FL., pp. 1201-1206, May 2001.
183. P. M. Raj, K. Shinotani, M. Seo, S. Bhattacharya, V. Sundaram, S. Zama, J. Lu, C. Zweben, G. White and Rao R Tummala, “Selection and Evaluation of Materials for Future System-on-package (SOP) Substrate”, Proceedings of the 51 st ECTC Conference, pp. 1193-1197, May 2001.
184. S. K. Bhattacharya, H. Morales, P. Markondeya Raj, K. Shinotani and R. R. Tummala, “An Alternative method for thin polymer coating on large area sop substrates”, Proceedings of INTERPACK’01 The Pacific/RIM ASME International Electronics Packaging, Technical conference and Exhibition, Hyatt Regency Hotel, Kauai, USA, July 8-13, 2001.
185. Rao R. Tummala, Kenichi Shintotani, V.Sundram, Swapan Bhattacharya, George White, Fuhan Liu, P. Markondeya Raj, Lixi Wan, Seock Hee Lee and D.Ravi, “what is the future of electronics? Is it SOP or SOC ”, Invited Paper in ICEP 2001Conference, Japan, April 2001.
186. R. R. Tummala, P. Markondeya Raj and R. Mani, “Ceramics for IT”, Proceedings of International Society for Advanced Ceramics, ISAC., Indian Ceramic Society, 2001.
187. V. Sundaram, F. Liu, G. White and Rao R Tummala, “Process Integration for Low-cost System on a Package (SOP) Substrate, ” Proceedings of the 51 st ECTC Conference, Orlando, FL, May 2001.
188. H. Windlass, P. Raj, D. Balaraman, S. Bhattacharya and Rao R Tummala, “Processing of Polymer-Ceramic Nanocomposites for System-on-package Applications”, Proceedings of the 51 st ECTC Conference, May 2001.
189. S. Banerji, P. Raj, K. Shinotani, M. Seo, C. Zweben, S. Bhattacharya and Rao R Tummala, “Control of Warpage During Build-up of Multilayered High-density Wiring with Stiff and Low- CTE Base Substrates, ” Proceedings of the IMAPS HDI Conference, pp. 279-284, April 2001.
190. H. Windlass, P. Raj, D. Balaraman, S. Bhattacharya and Rao R Tummala, “Colloidal Processing of Polymer Ceramic Nanocomposites for Integral Capacitors, ” Proceedings of the IMAPS International Symposium on Advanced Packaging Materials, pp. 393-398, Braselton, GA, April 2001.
191. K. Shitontani, V. Sundaram, S. Bhattacharya, G. White, F. Liu, P. Raj, L. Wan, S. Lee, D. Ravi and Rao R Tummala, “SOP vs. SOC at Georgia Tech PRC”, Proceedings of the International Conference on Electronic Packaging, pp. 1-8, Tokyo, Japan, April 2001.
192. F. Liu, V. Sundaram, D. Sutter, G. White and Rao R Tummala, “Ultra- HDI with Low-Cost Photo-Polymers, ” Proceedings of International Symposium on Advanced Packaging Materials, 153-158, Chateau Elan, Braselton, GA, March 2001.
193. W. Kim, S. Lee, M. Swaminathan and Rao R Tummala, “Robust Extraction of the Frequency-dependent Characteristic Impedance of Transmission Lines Using One-port TDR Measurements”, EPEP Proceedings, 2001.
194. S. Dalmia, S. Lee, V. Sundaram, S. Min, M. Swaminathan and Rao R Tummala, “CPW High Q Inductors on Organic Substrates, ” EPEP Proceedings, 2001.
195. S.H. Min, S.H. Lee, W. Kim, S. Dalmia, M. Swaminathan, F. Liu and Rao R Tummala, “Design, Fabrication, Measurement, and Modeling of Embedded Inductors in Laminate Technology”, Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference, IPACK2001 pp.–15789 2001.
196. W. Kim, S. Lee, M. Swaminathan, and R. Tummala, "Robust Extraction of the Frequency-dependent Characteristic Impedance of Transmission Lines Using One-port TDR Measurements, " EPEP Proceedings, 2001.
197. S. Dalmia, S. Lee, V. Sundaram, S. Min, M. Swaminathan, and R. Tummala, "CPW High Q Inductors on Organic Substrates, " EPEP Proceedings, 2001.
198. S. Dalmia, S. Min, W. Kim, M. Swaminathan, V. Sundaram, F. Liu, G. White, and R. Tummala, "Design of Embedded High-Q Inductors in MCM -L Technology, " Accepted for Publication in the Proceedings of IMS 2001 Conference, May 2001.
199. J. Hobbs, H. Windlass, V. Sundaram, S. Chun, M. Swaminathan, and R. Tummala, "Simultaneous Switching Noise Suppression for High Speed Systems Using Embedded Decoupling, " Proceedings of the 51 st ECTC Conference, Orlando, Florida, May 2001.
200. F. Liu, J. Lu, V. Sundaram, D. Sutter, G. White, D. Baldwin, and R. Tummala, "Reliability Assessment of Microvias in HDI Printed Circuit Boards, " Proceedings of the 51st ECTC Conference, May 2001.
201. R. Tummala, "Undergraduate Microsystems Packaging Education: Needs, Status and Challenges, " Proceedings of the 51 st ECTC Conference, Orlando, FL, May 2001.
202. P. Raj, K. Shinotani, M. Seo, S. Bhattacharya, V. Sundaram, S. Zama, J. Lu, C. Zweben, G. White, and R. Tummala, "Selection and Evaluation of Materials for Future System-on-Package (SOP) Substrate, " Proceedings of the 51 st ECTC Conference, pp. 1193-1197, May 2001.
203. V. Sundaram, F. Liu, G. White, and R. Tummala, "Process Integration for Low-Cost System on a Package (SOP) Substrate, " Proceedings of the 51 st ECTC Conference, Orlando, Florida, May 2001.
204. M. Varadarajan, J. Hobbs, S. Bhattacharya, O. Sanchez, R. Tummala, and G. May, "A Hands-On Multi-disciplinary Product Development Course for Micro Systems Packaging Education at Georgia Tech, " Proceedings of the 51 st ECTC Conference, pp. 405 - 409, May 2001.
205. H. Windlass, P. Raj, D. Balaraman, S. Bhattacharya, and R. Tummala, "Processing of Polymer-Ceramic Nanocomposites for System-On-Package Applications, " Proceedings of the 51 st ECTC Conference, May 2001.
206. S. Banerji, P. Raj, K. Shinotani, M. Seo, C. Zweben, S. Bhattacharya, and R. Tummala, "Control of Warpage During Build-up of Multilayered High-density Wiring with Stiff and Low- CTE Base Substrates, " Proceedings of the IMAPS HDI Conference, pp. 279-284, April 2001.
207. H. Windlass, P. Raj, D. Balaraman, S. Bhattacharya, and R. Tummala, "Colloidal Processing of Polymer Ceramic Nanocomposites for Integral Capacitors, " Proceedings of the IMAPS International Symposium on Advanced Packaging Materials, Braselton, GA, pp. 393-398, April 2001.
208. R. Tummala, K. Shintotani, V. Sundaram, S. Bhattacharya, G. White, F. Liu, P. Raj, L. Wan, S. Lee, and D. Ravi, "SOP vs. SOC at Georgia Tech PRC, " Proceedings of the International Conference on Electronic Packaging, Tokyo, Japan, pp. 1-8, April 2001.
209. R. Tummala, "SOP vs. SOC at Georgia Tech PRC, " Proceedings of the ICEP Conference, Tokyo, Japan, April 2001.
210. F. Liu, V. Sundaram, D. Sutter, G. White, and R. Tummala, "Ultra- HDI with Low-Cost Photo-Polymers, " Proceeding of the IMAPS International Symposium on Advanced Packaging Materials, March 2001.

2000-1996 <Top>

211. S. Bhattacharya, B. Gardner, J. Qu, D. Baldwin and R Tummala, “Low-cost Large Area Processing Using Small Area Substrates-A Novel Multi-tiled Palletization Concept for MCM -D Thin-film Process”, IEEE Transactions on Advanced Packaging, vol. 23, no. 4, pp. 661-671, November 2000.
212. F. Liu, V. Sundaram, G. White and R Tummala, “Ultra-fine Photoresist Image Formation for Next Generation High-density PWB Substrates, ” The International Journal of Microelectronics & Electronic Packaging, vol. 23, no. 3, pp. 339-345, November 2000.
213. F. Liu, V. Sundaram, G.E. White and R Tummala, “Ultra - fine Line HDI Technology at Georgia Tech Packaging Research Center ”, High Density Interconnect, pp. 20-24, August 2000.
214. R Tummala, “ SOC vs. SOC : Needs, Challenges, and Status, ” VLSI Workshop, Cork, Ireland, May 2000.
215. R Tummala, “System-on-a-package (SOP) Research and Education at the Georgia Institute of Technology Packaging Research Center”, IEMT- IMC, Japan, April 2000.
216. R Tummala, “MPA Roadmap: Preparing Hong Kong and Pearl River Delta’s Electronics into the New Millennium”, Hong Kong, January 2000.
217. Swapan Bhattacharya and Rao Tummala, "Development of Epoxy Nanocomposite Capacitors for MCM -L Compatible Integral Passive Technology, " ASME Journal of Electronic Packaging, Vol. 123, pp. 1-6, December 2000.
218. Rao Tummala, George White, Venky Sundaram, and Swapan Bhattacharya, "SOP: The Microelectronics for the 21st Century with Integral Passive Integration, " Advancing Microelectronics, pp. 13-19, 27 (2000).
219. Swapan Bhattacharya, J. Park, Rao Tummala, and Mark Allen, "Fabrication of a Fully Integrated Passive Module for Filter Application, " Journal of Materials Science, Materials in Electronics, pp. 455-460, 11 (2000).
220. O. Misman, Swapan Bhattacharya, Ahmet Erbil, and Rao Tummala, "PWB Compatible High Value Integral Capacitors by MOCVD, " J. Materials Science, Materials in Electronics, pp. 657-660, 11 (2000).
221. Swapan Bhattacharya and Rao Tummala, "Next Generation Integral Passives: Materials, Processes, and Integration of Resistors and Capacitors on PWB Substrates, " Journal of Materials Science, Materials in Electronics, pp. 253-268, 11 (2000).
222. J. Wu, Swapan Bhattacharya, M. Wong, C. Lloyd, Rao Tummala, C.P. Wong, and H. Pogge, "Development of a High-performance Filling Encapsulant for System Chip Application, " IEEE Transactions on Components and Packaging Technologies, accepted December 2000 (to be published 2001).
223. Fuhan Liu, Venky Sundaram, George White, and Rao Tummala, "Ultra-Fine Photoresist Image Formation for Next Generation High-Density PWB Substrates, " The International Journal of Microelectronics & Electronic Packaging, Volume 23, Number 3, pp. 339-345, November 2000.
224. Swapan Bhattacharya, B. Gardner, Jianmin Qu, Dan Baldwin, Rao Tummala, "Low-cost Large Area Processing Using Small Area Substrates - A Novel Multi-tiled Palletization Concept for MCM -D Thin-film Process, " IEEE Transactions on Advanced Packaging, Vol. 23, No. 4, pp. 61-671, November 2000.
225. Rao R. Tummala, Venky Sundaram, George E. White, and Swapan Bhattarcharya, "SOP: The Microelectronics For the 21 st Century with Integral Passive Integration", Advancing Microelectronics, pp. 10-15, January 2000.
226. S. Bhattacharya and R. Tummala, "Next Generation Integral Passives: Materials, Processes, and Integration of Resistors and Capacitors on PWB Substrates, " Journal of Materials Science, Materials in Electronics, Vol. 11, pp. 253-268, 2000.
227. Swapan Bhattacharya, Dan Baldwin, Suresh Sitaraman, Jianmin Qu, C.P. Wong, C. Ume, and Rao Tummala, "Low Cost MCM : Large Area Packaging using Small Area Substrates, Part 2, " High-Density Interconnect International, October 2000, pp. 36-39.
228. Swapan Bhattacharya, Dan Baldwin, Suresh Sitaraman, Jianmin Qu, C. P. Wong, I. C. Ume, and Rao Tummala, "Low Cost MCM : Large Area Packaging Using Small Area Substrates, Part 1, " High-Density Interconnect International, September 2000, pp. 20-25.
229. Fuhan Liu, Venky Sundaram, George White, and Rao Tummala, "Ultra Fine Line HDI Technology at Georgia Tech PRC, " HDI -The Magazine of High-Density Interconnect, August 2000, pp. 20-24.
230. S. Bhattacharya, D. Baldwin, S. Sitaraman, J. Qu, C.P. Wong, C. Ume and Rao R Tummala, “Low Cost MCM : Large Area Packaging Using Small Area Substrates, Part 1”, High-density Interconnect International, pp. 20-25, September 2000.
231. P.M. Raj, K. Shinotani, H. Agarwal, G.E. White and Rao R Tummala, “Evaluation of Carbon-filled Polymer Composites for Future Base Substrate and Integral Resistor Applications”, IMAPS 2000, pp. 351-356, Boston, MA, September 2000.
232. P.M. Raj, K. Shinotani, H. Agarwal, G.E. White and Rao R Tummala, “SOP: Microelectronics Systems Packaging Technology for the 21 st Century, ” Proceedings of IC-Package Co-Design Conference, Zurich, Switzerland, March 2000.
233. S. Bhattacharya, D. Baldwin, S. Sitaraman, J. Qu, C.P. Wong, C. Ume and Rao R Tummala, “Low Cost MCM : Large Area Packaging Using Small Area Substrates, Part 1, ” High-density Interconnect International, pp. 20-25, September 2000.
234. P.M. Raj, K. Shinotani, H. Agarwal, G.E. White and Rao R Tummala, “Evaluation of Carbon-filled Polymer Composites for Future Base Substrate and Integral Resistor Applications”, IMAPS 2000, pp. 351-356, Boston, MA, September 2000.
235. Rao R Tummala, “SOP and SOC : The Best of Both, ” SSDN, Japan, August 2000.
236. Rao R Tummala, “What is the Next Step after CSP, BGA, Micro-via, Flip Chip, and MCM ? Is it Chip Integration ( SOC ) or Packaging Integration (SOP) Enabling SOC ?” IMAPS Israel 2000, Tel Aviv, Israel, June 2000.
237. P.M. Raj, H. Windlass, K. Shinotani, S. Bhattacharya, V. Sundaram and Rao R Tummala, “Delamination Issues in Integration of Highly Filled Polymer-ceramic Nanocomposite Films on MCM -L Compatible Substrates, ” 50th ECTC, pp. 1681-1685, Las Vegas, NV, May 2000.
238. J. Wu, S. Bhattacharya, M. Wong, C. Lloyd, C.P. Wong, H. Pogge and Rao R Tummala, “Evaluation and Characterization of High-performance Filling Encapsulant for System-on- Chip Application, ” IEEE 50th ECTC, pp. 937-943, Las Vegas, NV, May 2000.
239. Rao R Tummala, “SOP vs. SOC for the Microelectronics Systems of the Future?” IMAPS Microelectronics Prague 2000, Prague, Czech Republic, April 2000.
240. F. Liu, V. Sundaram, G. White and Rao R Tummala, “Ultra-fine Photoresist Image Formation for Next Generation High-density PWB Substrate”, Proceedings of HD International–Conference on High Density Interconnects and Systems Packaging, pp. 467-472, Denver, CO, April 2000.
241. Rao R Tummala, “System-on-package (SOP) Vision, Status & Challenges”, 5th IMAPS-IEEE Joint Symposium, Seoul, South Korea, April 2000.
242. H. Windlass, P. Markondeya Raj, V. Sundaram, K. Shinotani, S. K. Bhattacharya and R. R. Tummala., “Delamination issues in integration of highly filled polymer ceramic nanocomposites on MCM -L compatible substrates”, Proceedings, Electronic Components and Technology Conference, Las Vegas, pp. 1681-1685, May 21-24, 2000.
243. H. Windlas, P.M. Raj, S. Bhattacharya and Rao R Tummala, “Optimized Suspension Formulations for Improved Dielectric Properties of Ceramic-polymer Nanocomposites for Integral Capacitor, ” IMAPS Advanced Passive Technology Workshop, Denver, CO, April 2000.
244. J. Wu, S. Bhattacharya, M. Wong, C. Lloyd, C.P. Wong, H. Pogge and Rao R Tummala, “A Novel High-performance Epoxy Filling Encapsulant for System on Chip Application, ” IMAPS International Conference on Emerging Microelectronics, EMIT 2K, pp. 318-329, Bangalore, India, February 2000.
245. V. Sundaram, F. Liu, G.E. White and Rao R Tummala, “Fully Integrated Substrate Technology for Next Generation Electronics, ” Proceedings of IMAPS International Conference on Emerging Microelectronics, EMIT 2K, pp. TP3-1.1, Bangalore, India, February 2000.
246. Rao R Tummala, “SOP: Microelectronics and Packaging Technology for the 21st Century, ” Proceedings of GOMAC, Anaheim, CA, January 2000.
247. Pulugurtha M. Raj, Ken-ichi Shinotani, Himanshu Agarwal, George E. White and Rao Tummala, "Evaluation of Carbon-Filled Polymer Composites for Future Base Substrate and Integral Resistor Applications, " IMAPS 2000, Boston Hynes Convention Center, Boston, MA, September 20-22, 2000, pp. 351-356.
248. Leyla Conrad, Rao Tummala, and Gary May, "The First Entrepreneurial and Practice-Oriented Masters Program in Microelectronics Systems Packaging, " Proceedings of the 50th Electronic Components & Technology Conference, Las Vegas, NV, May 2000, p. 1002.
249. Pulugurtha M. Raj, Hitesh Windlass, Kenichi Shinotani, Swapan Bhattacharya, Venky Sundaram and Rao Tummala, "Delamination Issues in Integration of Highly Filled Polymer-ceramic Nanocomposite Films on MCM -L Compatible Substrates, " 50th ECTC, Las Vegas, NV, May 2000, pp. 1681-1685.
250. J. Wu, Swapan Bhattacharya, M. Wong, C. Lloyd, Rao Tummala, C.P. Wong, and H. Pogge, "Evaluation and Characterization of High-performance Filling Encapsulant for System Chip Application, " IEEE 50th ECTC, Las Vegas, NV, May 2000, pp. 937-943.
251. Fuhan Liu, Venky Sundaram, George White, and Rao Tummala, "Ultra-Fine Photo-resist Image Formation for Next Generation. High-Density PWB Substrates, " Proceedings of The International Conference on High-Density Interconnect and Systems Packaging, Denver, CO, April 26-28, 2000, pp. 467-471.
252. Fuhan Liu, Venky Sundaram, George White and Rao Tummala, "Ultra-Fine Photoresist Image Formation for Next Generation High-Density PWB Substrate, " Proceedings of HD International - Conference on High Density Interconnects and Systems Packaging, Denver, Colorado, April 2000, pp. 467-472.
253. O. Misman, Swapan Bhattacharya, Ahmet Erbil, and Rao Tummala, "PWB Compatible Thick and Thin Film Integral Capacitors, " IMAPS International Conference on Emerging Microelectronics, EMIT 2K, Bangalore, India, February 2000, TP6-1, pp. 143-150.
254. J. Wu, Swapan Bhattacharya, M. Wong, C. Lloyd, Rao Tummala, C.P. Wong, and H. Pogge, "A Novel High- Performance Epoxy Filling Encapsulant for System on Chip Application, " IMAPS International Conference on Emerging Microelectronics, EMIT 2K, Bangalore, India, February 2000, TP9-5, pp. 318-329.
255. Venky Sundaram, Fuhan Liu, George E. White, and Rao R. Tummala, "Fully Integrated Substrate Technology for Next Generation Electronic Packaging, " Proceedings of IMAPS International Conference on Emerging Microelectronics, EMIT 2K, Bangalore, India, February 2000, pp. TP3-1.1.
256. Schubert, R. Dudek, R. Leutenbauer, R. Doring, J. Kloeser, H. Oppermann, B. Michel, H. Reichl, D. Baldwin, J. Qu, S. Sitaraman, M. Swaminathan, R. Tummala, C. Wong, "Do Chip Size Limits Exist for DCA?, " IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 4, pp. 255-263, October 1999.
257. R. Tummala, Profiled in American Ceramic Society Bulletin, October 1999, Vol. 78, No. 10, pp. 44-50.
258. R. Tummala, G. White, V. Sundaram, and S. Bhattacharya, "SOP: The Microelectronics for the 21 st Century with Integral Passive Integration, " Advancing Microelectronics, May/June 1999, pp. 29-37.
259. R. Tummala, G. May, and L. Conrad, "Georgia Tech's Electronics Systems Packaging Education: A Model for the 21 st Century, " The Circuit, Vol. 2, #1, p. 8, 1999.
260. S. Bhattacharya and R. Tummala, "Epoxy nanocomposite capacitors for integral passives technology, " ASME International Mechanical Engineers Conference, Technical Paper 99-IMECE/EEP-25, pp. 1-8, Nashville, Tennessee, November 1999.
261. Rao Tummala and Weiping Li, "Interfacial Adhesion of Plated Copper on Polymer Dielectric in High Density Buildup Substrate Technology, " IMAPS 32nd International Symposium on Microelectronics, pp. 348-353, October 1999.
262. Rao R. Tummala, George E. White, and Venky Sundaram, "SOP: Microelectronics Systems Packaging Technology for 21st Century; Prospects and Progress, " European Micro Conference, Manchester, London, pp. 327-335, June 1999.
263. R. Tummala, L. Conrad, and G. May, "Next Generation of Microelectronic Packaging Education in U.S. : A Perspective on Needs, Challenges and Status, " InterPACK ' 99 Conference, Maui, Hawaii, pp. 2159-2164, June 13-19, 1999.
264. R. Tummala, L. Conrad, and G. May, "The Needs, Evolution, Status and Challenges of Microelectronics Packaging Education in the U.S., " 4 9 th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999.
265. R. Tummala, G. White, V. Sundaram, and S. Bhattacharya, "SOP: The Microelectronics for the 21st Century with Integral Passive Integration, " Proceedings, IEMT/ IMC Microelectronic Packaging Innovation for the New Century, Sonic City-Omiya, Tokyo, April 21-23, 1999.
266. T. Troutman, S. Bhattacharya, C. P. Wong, and R. Tummala, "Development of low viscosity, high dielectric constant polymers for integral passive applications, " Proceedings of the 5 th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, Georgia, pp. 169-173, March, 1999.
267. Rao. R. Tummala, A. Schubert, R. Dudek, R. Leutenbauer, J. Kloeser, H. Oppermann, B. Michel, H. Reichl, D. Baldwin, J. Qu, S. Sitaraman, M. Swaminathan, and C.P. Wong, "Do Chip Size Limits Exist for DCA?", Proceedings of the 5th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, Georgia, March, 1999.
268. Schubert, R. Dudek, R. Leutenbauer, R. Doring, J. Kloeser, H. Oppermann, B. Michel, H. Reichl, D. Baldwin, J. Qu, S. Sitaraman, M. Swaminathan, C.P. Wong, and R. Tummala, "Do Chip Size Limits Exist for DCA?" IMAPS/IEEE Proceedings of the 5 th International Symposium on Advanced Packaging Materials, Braselton, GA, pp. 150-162, March, 1999.
269. R. R. Tummala, "Electronic Packaging Research and Education: A Model for the 21 st Century, " Johns Hopkins APL Technical Digest, April 1998.
270. P. Chahal, R. R. Tummala, M.G. Allen and M. Swaminathan, "A Novel Integrated Decoupling Capacitor for MCM -L Tech., " IEEE Transactions in Components, Packaging, and Manufacturing Technology-Part B, March 1998.
271. R. R. Tummala, "Electronic Packaging Research and Education in the 21 st Century, " Business Briefing ASEAN: Semiconductor Manufacturing Technology, Summer 1998.
272. W. Li, R. R. Tummala, R. Funer, and C. Sullivan, "Materials, Processes and Reliability Evaluation of Photodielectrics for Sequential Circuit Application, " The International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 3, 1997.
273. S. Bhattacharya, R.R. Tummala, and P. Chahal, “Integration of Polymer/Ceramic Thin Film Capacitors on PWB, ” 3 rd International Symposium on Advanced Packaging Materials, pp. 68-70, 1997.
274. P. Chahal, R. R. Tummala, and M.G. Allen, “Integrated Capacitors using Polymer-Ceramic Comp. For MCM -L, “3 rd International Symposium on Microelectronics, pp. 126-131, 1996.
275. P. Chahal, R.R. Tummala, M.G. Allen, and M. Swaminathan, “A Novel Integrated Decoupling Capacitor for MCM -L Tech., “46 th Elect. And Tech. Conf., pp. 125-133, 1996.

1995-1991 <Top>

276. Rao R. Tummala and M.Pecht, "Japanese Electronic Packaging Technologies, " JTEC Panel Report, published by Loyola College, MD, pp. 59-96, February 1995.
277. W.R. Bulton, E.S. Meiran and Rao R. Tummala, " Japan 's Technology and Manufacturing Infrastructure, " JTEC Panel Report, published by Loyola College, MD, pp. 35-58, 1995.
278. Rao R. Tummala, ""Electronic Packaging Education in US, " Proceedings of Materials Research Society, San Francisco, April 1995.
279. T.J. Sleboda and Rao Tummala, “Plated Through-hole Reliability of Formaldehyde Electroless Copper Depositions, ” 45 th ECTC, pp. 58-63, 1995.
280. Rao R. Tummala, "Multichip Technology for Revolutionary Electronics in 21 st Century, " Proceedings of International Conference on Microsystems Technology, pp. 221-225, Berlin, Germany, October 1994.
281. Rao R. Tummala, "Integrated Substrate, " Proceedings of 4 th International Conference on Electroceramics and Applications, pp. 118-123, Aachen, Germany, 1994.
282. Rao R. Tummala, M. Haley, and G.C. Zornyj, "Materials in Microelectronics, " Ceramic International, Vol. 19, pp. 191-210, December 1993.
283. Rao R. Tummala, E.Perfecto, et al, "Multilevel Thin Film Packaging Technology at IBM, " Proceedings of International Conference on Multichip Modules, pp. 419-423, Denver, 1993.
284. Rao R. Tummala, "Multichip Packaging, a Tutorial, " Proceedings of IEEE, Vol. 80, pp. 1924-41, December 1992.
285. Rao R. Tummala et al., "Glass-Ceramic/Copper Multilayer Substrate: A New Generation of High Performance Multilayer Ceramic Substrate for 1990's, " IBM Journal of Research and Development, Vol. 36, pp. 889-904, September 1992.
286. A.H. Kumar and Rao R. Tummala, "The Past, Present and Future of Multilayer Ceramic Packaging, " Journal of Metals, Vol. 44, (7), pp. 10-14, July 1992.
287. Rao R. Tummala, "63 Layer Glass-Ceramic/Copper Thin Film Thermal Conduction Module, " IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 15, (4), pp. 4426-431, April 1992.
288. Rao R. Tummala and S. Ahmeeed, "Overview of Packaging for the IBM Enterprise System/9000 Based on Glass-Ceramic/Copper Thin Film Thermal Conduction Module, " IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 15, (4), pp. 426-431, April 1992.
289. Rao R. Tummala, "Glass-Ceramic: Its Use As a Multilayer Substrate, " Advanced Packaging Magazine, pp. 5-7, September 1992.
290. Rao R. Tummala, "Thin Film, Ceramic and PWB Multichip Technology for Computer Applications, " Proceedings of ISHM, pp. 678-681, San Francisco, October 1992.
291. Rao R. Tummala, "Multichip Packaging in IBM, " Proceedings IEEE-CPMT, pp. 1-9, San Diego, May 1992.
292. Rao R. Tummala, A.H. Kumar, and J. Knickerbocker, "Sinterable Glass-Ceramic for High Performance Substrates, " Proceedings of ECTC, pp. 678-681, San Diego, May 1992.
293. Rao R. Tummala, and A.H. Kumar, "An Overview of Advanced Ceramic Packaging Technologies, " Annual Meeting of Ceramic Society, International Congress of Ceramics and Glasses, San Francisco, pp. 83-99, 1992.
294. Rao R. Tummala, G. Czornyi and M. Haley, “Materials in Microelectronics, “Proceedings of International Materials Conference, ( IMAT - Italy), pp. 191-210, June 1992.
295. Rao R. Tummala and A.H. Kumar, "Glass-Ceramic/Copper Multilayer substrate from IBM System 390/9000- Materials and Process Challenges, " International Journal for Hybrid Microelectronics, Vol. 14, pp. 137-150, December 1991.
296. Rao R. Tummala and C.L. Eggerding, "Ceramic Packaging with Ferroelectric Decoupling Capacitor, " IEEE Symposium on Applications of Ferroelectrics, Vol. 41, pp. 28-30, October 1991.
297. Rao R. Tummala, "Electronic Packaging in the 1990's-A Perspective from America, " Transactions of IEEE Components, Hybrids and Manufacturing Technical Society, Vol. 14, pp. 262-271, June 1991.
298. Rao R. Tummala, "Ceramic and Glass-Ceramic Packaging in 1990's, " Journal of American Ceramic Society, Vol. 74, pp. 895-908, May 1991.
299. Rao R. Tummala, "Advanced Packaging of IBM Latest Mainframe Computers, " Proceedings of ISHM-Europe, pp. 16-21, Rotterdam, May 1991.
300. Rao R. Tummala, H.R. Potts, and S. Ahmed, "Packaging Technology for IBM System 390/ES9000, Model 820 and 920, " Proceedings of Electronic Components and Technology Conference(ECTC), pp. 682-690, Atlanta, May 1991.
301. Rao R. Tummala, "Ceramic and Glass-Ceramic Packaging, " Proceedings of Materials Research Society, pp. 221-226, January 1991.
302. Rao R. Tummala, R.N. Master, and L.W. Heron, "Cofiring Process for Glass-Ceramic/Copper Multilayer Substrates, " Proceedings of IEEE-CPMT, pp. 5-9, 1991.

1990-1981 <Top>

303. Rao R. Tummala, "Glasses and Glass-Ceramics in Microelectronics, " Proceedings of the International Symposium on Ceramics, pp. 216-221, Orlando, November 1990.
304. Rao R. Tummala, "Ceramic and Glass-Ceramic Packaging, " Proceedings of Materials Research Society, pp. 39-45, Boston, November 1990.
305. Rao R. Tummala, "Advanced Packaging Technology Overview, " IEEE-IEMT Proceedings, pp. 259-271, Stresa, Italy, May 1990.
306. Rao R. Tummala, "Advanced Packaging Technology Overview, " IEEE-IEMT Proceedings, pp. 16-20, San Francisco, October 1989.
307. Rao R. Tummala, "Glasses in Microelectronics, " 2 "d International Symposium on Glass Proceedings, pp. 85-98, Tokyo, November 1989.
308. Rao R. Tummala, "Packaging Technologies in 1990's, " IEPS Proceedings, pp. 39-46, San Diego, September 1989.
309. Rao R. Tummala, "Ceramics in Microelectronics, " Ceramics International, Vol. 13, pp. 1-11, July 1988.
310. Rao R. Tummala, "Ceramic Packaging in Microelectronics, " Bulletin American Ceramic Society, Vol. 67, pp. 752-758, April 1988.
311. Rao R. Tummala, "Advanced Packaging Technologies in U.S.A., "Proceedings of International Microelectronics Conference, pp. 12-18, Tokyo, May 1988.
312. Rao R. Tummala, "Ceramics in Information Processing Industry, High Tech Ceramics, " editor, Elseview Science Publishers, B.V., Amsterdam, 1987.
313. Rao R. Tummala, "Glasses in Microelectronics & Information Processing Industry, " Ceramic International, Vol. 18, pp. 87-102, 1986.
314. Rao. R. Tummala, “High Performance Electronic Packaging, “Proceedings of International Society for Hybrid Microelectronics, Stresa, Italy, 1985.

1980-1969 <Top>

315. Rao. R. Tummala, “Glass Science in 1990’s, “Proceedings of Norbert Kreidl Symposium”, Vienna, Austria, 1984.
316. Rao R. Tummala and A. L. Friedberg, "Thermal Expansion of Glass-Crystal Composites as Affected by the Matrix, " Journal of American Ceramic Society, 54 (7), 376-80, 1979.
317. Rao R. Tummala, "Application of Borate Glasses in Electronics, "Borate Glasses: Structure, Properties and Applications, edited by L. D. Pye, et.al., Plenum Publishing Corp., 1978.
318. A. H. Kumar and Rao R. Tummala, "TiO 2-Dopes Lead-Zinc Borate Glass for Protecting Circuits on Alumina Substrates, " American Ceramic Society Bulletin, 57(8), 738, 1978.
319. J. L. Powell and Rao R. Tummala, "Crystallization in Copper-Containing Solder Glasses, " Journal of Electrochemical Society, 125 (3), 1978.
320. Rao R. Tummala, "Effect of HNO 3 Etching on Strength of Lead Glasses, " Journal of American Ceramic Society, 60 (3), 170, 1977.
321. Rao R. Tummala, "Reply to Comments by R. 3. Charles, on Stress Corrosion of Very Low-Melting Solder Glasses, " Journal of Non-Crystalline Solids, 21, 429, 1976.
322. Rao R. Tummala, "Stress Corrosion Resistance vs. Thermal Expansion and Chemical Durability of Glasses, " Journal of Glass Technology, 17(4), 145-146, 1976.
323. Rao R. Tummala, "Low-Temperature and Low-Thermal Expansion Composites Containing Peroskite, " Journal of Materials Science, 11(1), 125-128, 1976.
324. Rao R. Tummala, "Stress Corrosion of Very Low-Melting Solder Glasses, "Journal of Non-Crystalline Solids, 19, 263-272, 1976.
325. Rao R. Tummala, "Glass Transition Temperature of Glass Mixtures as Determined by DTA, " Journal of Glass Technology, 1B (6), 149-150, 1975.
326. Rao R. Tummala, "Strength and Dynamic Fatigue of Float Glass Surfaces, " Journal of American Ceramic Society, 58 (3), 156, 1975.
327. Rao R. Tummala, "Dynamic Fatigue of a Low-Temperature Virtuous Solder Glass, " Bulletin of American Ceramic Society, 58 (3), 156, 1975.
328. Rao R. Tummala, "Glass-to-Metal and Glass-to-Ceramic Wetting in Water Vapor Atmospheres, " Journal of Materials Science, 10, 905-907, 1975.
329. Rao R. Tummala, "Mismatch Stresses in Glass Crystal Composites as Determined by Changes in Glass Transition Temperature, Journal of Materials Science, 6, 1531-33, 1971.
330. Rao R. Tummala, "Residual Stresses in Glass-Crystal Composites as Determined by Changes in Glass Transition Temperature, " Journal of Materials Science, 5, 713, 1970.
331. Rao R. Tummala, "Thermal Expansion of Composite Materials, " Journal of Applied Physics, 41, 5104-5107, 1970.
332. Rao R. Tummala, "Thermal Expansion of Composites Containing Uranium Dioxide, " Journal of Nuclear Materials, 32 (I), 17, 1969.
333. Rao R. Tummala, "Strength of Glass-Crystal Composites, " Journal of American Ceramic Society, 52 (4), 228-29, 1969.

Recent Invited Talks & Presentations

2006 <Top>

1. Rao Tummala, “Nano SOP for Ultra-Miniaturized Electronic and Bio-Electronic Systems", Pan Pacific Microelectronics Symposium, Hawaii, January 17, 2006.
2. Rao Tummala, “Future of Packaging and packaging Materials”, Advanced Packaging Materials conference, Atlanta, GA, March 16, 2006.
3. Rao Tummala, “System-on-Package Vs. System-in-Package and System-on-Chip: New Paradigms in Electronics,” 56th Electronic Components and Technology Conference, San Diego, CA, May 30, 2006.
4. Rao Tummala, “SOP; The 2nd Law of Electronics”, 8th Flextronics Technical Conference, Shah Alam, India, July 12, 2006.

2005 <Top>

5. Rao Tummala, “Moore ’s Law for Convergent Micro and Nanosystems”, Proceedings of European Conference on Nanotechnology, Berlin, Germany, January 12, 2005.
6. Rao Tummala, “Its Time for Second Moore’s Law—This Time for Mega-function Systems, Proceedings of Pan Pacific Microelectronics Conference. Kauai Hawaii, January 25, 2005.
7. Rao Tummala, “SOP: Moore ’s Law for System Integration”, IEEE European Conference, Berlin, Germany, Feb 2, 2005.
8. Rao Tummala, “SOP vs. SIP vs. SOC for Digital Convergence, ” ICEP 2005, Tokyo, Japan, April 13-15, 2005.
9. Rao Tummala, “US and Electronic Industry Competitiveness in view of Globalization and Changing Technologies”, IEEE Technical Seminar, Sunnyvale CA, May 4, 2005.
10. Rao Tummala, “Trends and Visions in Electronic Packaging", 8th International Academic Conference on Electronic Packaging Education and Training, Vienna, Austria, May 19, 2005.
11. Rao Tummala, “System-on-Package” (SOP)", Sixth Jisso International Council Meeting, Herndon, VA, May 26 th, 2005.
12. Rao Tummala, “Introduction to Nano Packaging and Systems”, IEEE ECTC, Orlando, FL, May 30, 2005.
13. Rao Tummala, “SOP Vs. SIP Vs. SOC“, IEEE ECTC, Orlando, FL, May 30, 2005.
14. Rao Tummala, “Packaging, Past, Present and Future”, ICEPT 2005, Shenzhen, China, August 31, 2005.
15. Rao Tummala, “System-on-Package (SOP)”, 3S workshop, Atlanta, GA, September 22, 2005.
16. Rao Tummala, " SOC Technology for Convergent Electronic & Bio-electronic Systems", 3rd Intl. SOC Conference, Newport Beach, CA, November 1-2, 2005.
17. Rao Tummala, “Spot Light on the PRC”, Annual NSF ERC Meeting, Bethesday, MD, November 18, 2005.
18. Rao Tummala, “SOP Second Moore 's Law“, EDAPS Conference, Bangalore, India, December 13, 2005.
19. Rao Tummala, “Status and Challenges in Materials”, International Conference on Advanced Design and Development of Materials, Goa, India, December 14, 2005.