NOTABLE LINKS

Georgia Institute of Technology:
- Packaging Research Center
- ECE Profile
- MSE Profile
- "Tummala Receives Tech's Highest Faculty Award" (June 1998)
- "Think Small (and Cheap)" (1995)
- "SOP for Multifunctional System Packages" (Mar 2006)

GT Research Horizons
"Moving Next-Generation Electronics Beyond Moore's Law"

IEEE Spectrum
"Moore's Law Meets Its Match" (June 2006)

Georgia Research Alliance
Rao Tummala: Eminent Scholar

Chip Scale Review
"System-on-Package Integrates Multiple Tasks" (Feb 2004)

American Ceramic Society
"Profiles in Ceramics: Electronic Packaging (1999, PDF)

IBM
"High Performance Glass-Ceramic/Copper Multilayer Substrate with Thin-film Redistribution" (1992, PDF)

Jacket Micro Devices
Advisory Board Member