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NOTABLE LINKS

Georgia Institute of Technology:
- Packaging Research Center
- ECE Profile
- MSE Profile
- "Tummala Receives Tech's Highest Faculty Award" (June 1998)
 - "Think Small (and Cheap)" (1995)
- "SOP for Multifunctional System Packages" (Mar 2006)

GT Research Horizons
"Moving Next-Generation Electronics Beyond Moore's Law"

IEEE Spectrum
"Moore's Law Meets Its Match" (June 2006)

Georgia Research Alliance
Rao Tummala: Eminent Scholar

Chip Scale Review
"System-on-Package Integrates Multiple Tasks" (Feb 2004)

American Ceramic Society
 "Profiles in Ceramics: Electronic Packaging (1999, PDF)

IBM
"High Performance Glass-Ceramic/Copper Multilayer Substrate with Thin-film Redistribution" (1992, PDF)

Jacket Micro Devices
Advisory Board Member

Patents & Inventions

Patents

Jump to: Inventions

 

Name

U.S. Patent

Title

Date

 

R. R. Tummala

3640738

Borosilicate Glass Composition for Electronic Packaging

11/20/70

 

R. R. Tummala and T. Sherk

3778127

Sealing Technique for Gas Panel Display

12/30/71

 

R. R. Tummala

3775999

Method of Sealing Electrodes to Glass

6/8/72

 

R. R. Tummala and B. Foster

3849190

Dielectric Glass Overlays and Method of Bubble-Free Process

4/20/73

 

R. R. Tummala and T. Sherk

3923530

Dielectric Glass Composition for Multilayer Substrate

6/27/73

 

R. R. Tummala and J. L. Powell

3841883

B 1 2 Os Containing PED-ZNO-B 20 3 Glass for Very Low Temperature Sealing

7/31/73

 

R. R. Tummala

3928051

Dielectric Glasses for Displays

12/6/73

 

R. R. Tummala and B. J. Foster

3975175

Process for Increasing the Strength of Lead Glass

6/25/74

 

R. R. Tummala

3904426

Process for Manufacturing Low Temperature Dielectric for Recording Heads

8/5/74

 

R. R. Tummala and T. A Sherk

3966449

Sealing Glass Composition and Process for Complete Displays

2/10/75

 

J. L. Powell and R. R. Tummala

3982918

Process for Preparing a Copper Containing Glass for Sealing Ceramic Packages

4/23/75

 

R. R. Tummala and A. Kendall

4122460

Ink Jet Nozzle Structures for Printing Information

8/10/77

 

A. H. Kumar, P. W. McMillan and R. R. Tummala

4301324

Glass-Ceramic Structures and Sintered Multilayer Substrates

2/6/78

 

A. H. Kumar, P. W. McMillan and R. R. Tummala

4221047

Multilayered Glass-Ceramic Substrate

3/23/79

 

L. W. Herron, R. Master, and R. R. Tummala

4234367

Method of Making Multilayered Glass Ceramic Substrate with Copper

3/23/79

 

J. L. Powell and R. R. Tummala

4224627

Seal Glass for Nozzle Assembly Most Alkali Resistant Glasses

6/28/79

 

R. R. Tummala

4221047

Multilayer Glass-Ceramic Substrate with 63 Layer Copper Wiring

1980

 

A. H. Kumar, P. W. McMillan and R. R. Tummala

4301369

Glass-Ceramic Structures and Sintered Multilayer Substrates

6/22/81

 

R. R. Tummala

4301324

Backside Coating Protecting of Multilayer Glass-Ceramic Substrate

1991

 

A. H. Kumar and R. R. Tummala

4698521

Backside Coating Protection of Multilayer Glass-Ceramic Substrate

1/93

 

S. Reddy and R. R. Tummala

4791202

Toughening of Glass-Ceramic Substrate

3/93

 

Inventions Published <Top>

    1. Method of Improving Electrical Insulation of Glasses, IBM Technical Disclosure Bulletin, Vol. 13 (5) 1262, 1970.
    2. Semicrystalline Ceramic, IBM Technical Disclosure Bulletin, Vol. 13 (6) 1449, 1970.
    3. Reducing Ferrite Etching by Glass, IBM Technical Disclosure Bulletin, Vol. 15 (2) 662, 1972.
    4. Making Thin Films of Low Dielectric Constant Glass, IBM Technical Disclosure Bulletin, Vol. 14{11) 3340, 1972.
    5. Glass Composition for Glass-Metal Package, IBM Technical Disclosure Bulletin, Vol. 16 (4) 1356, 1973.
    6. Eliminating of Curing of Glass Plates Above Annealing Point, IBM Technical Disclosure Bulletin, Vol. 16 (4) 1281, 1973.
    7. Glass-Fired Dielectric Films at Temperatures Below Softening Point, IBM Technical Disclosure Bulletin, Vol. 15 (9), 2926, 1973.
    8. Low-Temperature and Low-Expansion Novel Solder Glass, IBM Technical Disclosure Bulletin, Vol. 15 (11) 3384, 1973.
    9. Method of Sealing Gas Panel, IBM Technical Disclosure Bulletin, Vol. 17 (3) 843, 1974.
    10. Seal Glass Cleaning Procedure for Gas Panels, IBM Technical Disclosure Bulletin, Vol. 17 (3) 845, 1974.
    11. Method of Sealing Exhaust Tubulation for Gas Panels, IBM Technical Disclosure Bulletin, Vol. 17 (5) 1346, 1974.
    12. Exhaust Tube Seal for Display Panel, IBM Technical Disclosure Bulletin, Vol. 16 (9) 2943, 1974.
    13. Elimination of MgO Crazing by the Use of Non-Leads in Glass Panels, IBM Technical Disclosure Bulletin, Vol. 16 (11) 3632, 1974.
    14. Eliminating of MgO Cracking by the Use of Non-Lead Glass, IBM Technical Disclosure Bulletin, Vol. 16 (11) 3633, I974.
    15. Lead-Zinc-Borosilicate Glass for Protection of Insul-Braze on the Backside of MLC, IBM Technical Disclosure Bulletin, Vol. 18 (5) 1492, 1975.
    16. Eliminating of Cuprous Oxide Crystals in Copper-Containing Seal Glass, IBM Technical Disclosure Bulletin, Vol. 18, (6) 1859, 1975.
    17. Better Glasses for Use with Ferrite Recording Heads, IBM Technical Disclosure Bulletin, Vol. 17 (1) 2884, 1975.
    18. Packaging Ink Jet Nozzle Arrays, IBM Technical Disclosure Bulletin, Vol. 19 (11) 3296, 1975.
    19. Tube Seal Perform for Gas Panel Cast in Place, IBM Technical Disclosure Bulletin, Vol. 18 (5) 1428, 1976.
    20. Process of Fabricating Seedless Copper Containing Solder Glass Rods, IBM Technical Disclosure Bulletin, Vol. 19 (6) 2055, 1976.
    21. Tinning of Substrates to Protect Incusil Braze, IBM Technical Disclosure Bulletin, Vol. 19 (6) 2059, 1976.
    22. Casting Glass Powder Paste into Thin Seal Strips, IBM Technical Disclosure Bulletin, Vol. 18 (9) 2858, 1976.
    23. Devitrified Frit Seal Glass for Sealing Gas Panels, IBM Technical Disclosure Bulletin, Vol. 18 (10) 3221, 1976.
    24. Inorganic Sealing Glass for Fabricating Ink Jet, IBM Technical Disclosure Bulletin, Vol. 18 (11) 3614, 1976.
    25. Method of Eliminating Via-to-Via Cracking in Ceramic Substrates, IBM Technical Disclosure Bulletin, Vol. 20 (1), 141, 1977.
    26. Precrystallized Glass Powder in Producing Glass-Ceramic Substrates, IBM Technical Disclosure Bulletin, Vol. 21 (3), 1008, 1978.
    27. Laminated Ceramic Electro-Erosion Printing Head, IBM Technical Disclosure Bulletin, Vol.20 (10) 3924, 1978.
    28. Multi-Layer Ceramic (MLC) Substrates, IBM Technical Disclosure Bulletin, Vol. 20 (1 lb) 4787, 1978.
    29. Use of PZT for De-Coupling Capacitors, IBM Technical Disclosure Bulletin, Vol. 23 (8) 3229, 1980.
    30. Low-Capacitive Via Path Through High Dielectric Constant Materials, IBM Technical Disclosure Bulletin, Vol. 22 (12) 5330, 1980.
    31. Thick Film Termination of Low Termination of Low Inductance Capacitors, IBM Technical Disclosure Bulletin, Vol. 17, 1982.
    32. Discrete Thick Film Sedimented Capacitor, IBM Technical Disclosure Bulletin, Vol. 27, 1982.
    33. Preparation of Vias in Photosensitive Dielectrics, IBM Technical Disclosure Bulletin, Vol. 17, 1982.
    34. Method for Manufacturing A Multilayer Wiring Substrate, W. Li and R. Tummala, Application Serial # 09/249,449, Applied for February 1999.
    35. Large Area MCM ­D Thin Film Processing Using Small Area Substrates, S. Bhattacharya, D. Baldwin, C.P. Wong, J. Qu, I.C. Ume, S. Sitaraman, and R. Tummala. August 2, 1999 .
    36. Modified Hydrothermal Techniques for Integral Passives, Tummala, Rao R., Pulugurtha, Markondeya R., and Balaraman, Devarajan, 2001.
    37. Processing of Ceramic-Polymer Composites for Integral Capacitor Applications by Modified Hydrothermal Synthesis of Barium Titanate, Tummala, Rao R., Pulugurtha, Markondeva R., and Balaraman, Devarajan, 2001.
    38. Plated-Post, Photo-Polymer Technique to Construct Planar Multilayer Wiring Substrate with Filled and Stacked Vias, GTRC , 1946, Rao Tummala, 2001.
    39. Processing Of Ceramic Films For Integral Capacitor Applications By Modified Hydrothermal Synthesis Of Barium Titanate. Filed in the USPTO on February, 13, 2002 . This technique can achieve thin films with superior properties but without using costly vacuum equipment and processes like in other competitive technologies, 2002.
    40. A Novel Technique to Make High-Aspect-Ratio Metal-Coated Structures with Sub-Micron Gap-Spacing For MEMS, Integral Or Discrete Passives Applications, 2002.
    41. Sol-Gel Synthesis of Lead-free Solders, Georgia Tech Research Corporation, 2960, A. O. Aggarwal, P. M. Raj, I. R. Abothu and Rao Tummala, 2003.
    42. Polymer Based Compliant Interconnects for Fine Pitch Wafer Level Packages, A. O. Aggarwal, P. M. Raj and Rao Tummala, Georgia Tech Research Corporation, 3057, December 2003.
    43. The Ultra Higher Dielectric Constant Epoxy-metal Composite Based on Percolation Theory (PRC), Tummala, Rao R., Wong, C.P., 2004.
    44. Long-Period Fiber Granting Tuners/Modilators/Switches, Georgia Tech Research Corporation, 2268, Rao Tummala, Mahadevan Iyer , 2005.
    45. Improved Electroless Copper Plating Solution, Georgia Tech Research Corporation, 2530, Rao Tummala, Mahadevan Iyer , 2005.
    46. Flip Chip in Package (FCIP) and Direct Chip Attach (DCA) by Metallic Connects and Method for Making the Same, Georgia Tech Research Corporation, 3406, Fuhan Liu and Rao Tummala, March 2005.
    47. Integrated Capacitors from Metal Foils, GTRC , 3385, Rao Tummala, February 2005.
    48. Electroless Plated Low TCR Ni-W-P Alloy on BCB, GTRC , 3393, Swapan Bhattacharya, Rao Tummala, February 2005.
    49. Metal Stud Flip Chip on Board, GTRC , 3406, Fuhan Liu, Rao Tummala, March 2005.
    50. Underfill on Substrate Process, GTRC , 3410, Rao Tummala, March 2005.
    51. Low Temperature Coefficient of Capacitance ( TCC ) Nanocomposite Capacitor by Tailoring Filler Materials, GTRC , 3467, Rao Tummala, April 2005.
    52. Embedded Actives and Discrete Passives in a Cavity within Build-Up Layers, GTRC , 3552, Rao Tummala, Chong Yoon, July 2005.
    53. 3D Chip Stacking By Wire-On Bumps (WOB) Utilizing Bumps-on-Flex (BOF) and No Back Metallization Processes, GTRC , 3553, Rao Tummala, July 2005.
    54. High K 3D Capacitors, GTRC , 3569, Rao Tummala , July 2005.
    55. P olymer Based Compliant Interconnects for Fine Pitch Wafer Level Packages, Rao R. Tummala, 2005.
 
Contact Information
Phone: (404) 894-9097
Fax: (404) 894-3842
Email: rao.tummala@ece.gatech.edu

Georgia Institute of Technology
Packaging Research Center
Manufacturing Research Center (MaRC) Building
813 Ferst Drive, Room 351
Mail Code: 0250
Atlanta, GA 30332-0250