Consulting
Services
Throughout his impressive career, Rao Tummala has consulted for a large number of globally established packaging industry companies as well as academic and research institutions, government and military contractors. Among them are the following:
- International Business Machines (IBM)
- Hewlett-Packard
- Dupont
- Intel
- Department of Defense (DOD), United States
- National Science Foundation (NSF)
- Massachusetts Institute of Technology (MIT)
- University of California, Berkeley
- Jacket Micro Devices (JMD)
- RF Solutions
- Endicott Interconnect Technologies
- Flextronics
- MicroChem Corporation (MCC)
- Panda Project
- Dow Chemical
- RF Solutions
- Hong Kong City University; Roadmap Study; Chairman for Microelectronic Packaging and Assembly roadmap for Hong Kong/Southern China (1999)
- Photon Dynamics, San Jose , CA
- Washington Advisory Group (5/00)
- Georgia Tech - Broadband Institute
- EKC Technology, Inc., Hayward, CA , member
Contact Information
Phone: (404) 894-9097
Fax: (404) 894-3842
Email: rao.tummala@ece.gatech.edu
Georgia Institute of Technology
Packaging Research Center
Manufacturing Research Center (MaRC) Building
813 Ferst Drive, Room 351
Mail Code: 0250
Atlanta, GA 30332-0250