Books Written
Introduction to System-On-Package
McGraw-Hill, 2007, ISBN: 0071459065
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Fundamentals of Microsystems Packaging
McGraw-Hill, 2001, ISBN: 0071371699
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LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP
Written by Rao Tummala, the field's leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You'll find:
- Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
- Easy-to-read schematics and block diagrams
- Fundamental approaches to all system issues
- Examples of all common configurations and technologies--wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
- Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
- Basics of electrical and reliability testing
Microelectronics Packaging Handbook
Van Nostrand Reinhold, 1988, ISBN: 0-442-20578-3
Replaced by 3-part set below.
The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search.
Microelectronics Packaging Handbook (3-Part Set)
Springer, New York, N.Y., 1997, ISBN: 0-412-08431-7 (Part I ); 0-412-08441-4 (Part II ); 0-412-08451-1 (Part III)
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This thoroughly revised and updated three volume set continues to be the standard reference in 4he field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Contact Information
Phone: (404) 894-9097
Fax: (404) 894-3842
Email: rao.tummala@ece.gatech.edu
Georgia Institute of Technology
Packaging Research Center
Manufacturing Research Center (MaRC) Building
813 Ferst Drive, Room 351
Mail Code: 0250
Atlanta, GA 30332-0250