Biography | Awards, Honors & Memberships | Degrees & Affiliations | Books Written | Professional Society Contributions | Patents & Inventions | Global Industry Collaborations | Publications & Talks | Consulting Services | Personal Interests | HOME  

 

NOTABLE LINKS

Georgia Institute of Technology:
- Packaging Research Center
- ECE Profile
- MSE Profile
- "Tummala Receives Tech's Highest Faculty Award" (June 1998)
- "Think Small (and Cheap)" (1995)
- "SOP for Multifunctional System Packages" (Mar 2006)

GT Research Horizons
"Moving Next-Generation Electronics Beyond Moore's Law"

IEEE Spectrum
"Moore's Law Meets Its Match" (June 2006)

Georgia Research Alliance
Rao Tummala: Eminent Scholar

Chip Scale Review
"System-on-Package Integrates Multiple Tasks" (Feb 2004)

American Ceramic Society
"Profiles in Ceramics: Electronic Packaging (1999, PDF)

IBM
"High Performance Glass-Ceramic/Copper Multilayer Substrate with Thin-film Redistribution" (1992, PDF)

Jacket Micro Devices
Advisory Board Member

Awards, Honors & Memberships

Professional Society Awards

  • IEEE David Feldman Award, IEEE-CPMT Society (2007)
  • IEEE EAB Major Educational Innovation Award (2003)
  • Member, Academy of Engineering, India (2003)
  • Member, Indian National Academy of Engineering (2002)
  • Third Millenium Award from IEEE (2000)
  • John A. Wagnon’s Award from International Microelectronic And Packaging Society (1998)
  • John Jeppson Award from Am Ceramic Society (1997)
  • Fellow of International Microelectronic Packaging Society (1997)
  • Dan Hughes Award from International Microelectronic And Packaging Society (1997)
  • European Electronic Materials Award from DVM (1995)
  • IEEE Fellow (1993)
  • Member National Academy of Engineering, USA (1993)
  • Arthur Friedberg Memorial Award from American Ceramic Society (1993)
  • Sustained Technical Achievement Award from IEEE CPMT (1992)
  • Engineering Materials Achievement Award from ASM-International (1992)
  • David Sarnoff Award for Industry’s first MCM from IEEE (1991)
  • Fellow of American Ceramic Society (1986)
  • IBM Fellow (1984-1993)
  • IEEE CPMT society award to Prof. Rao Tummala and other PRC colleagues, professors and Ph.D.s.
    IEEE CPMT Society awards presented to Prof. Rao Tummala and PRC colleagues.
    IEEE Best Technical Paper Awards
    • Intel Fellowship paper
    • Motorola Fellowship paper
    • 11 Materials conference papers
    • 7 ECTC papers
    • EPTC Singapore papers

Industry Awards

  • Total Excellence in Electronics Manufacturing (TEEM) Award from Society of Manufacturing Engineers (1997)
  • Industry Week’s Award: one of 50 Stars in USA for Improving U.S. Competitiveness (1996)
  • 16 Corporate and Invention Awards from IBM

Academic Awards

  • Educator of the Year for Excellence in Teaching, Research, and Innovation in the Field of Electronics from the India-America Cultural Association (2002)
  • Visiting Professor, City University of Hong Kong (2001)
  • Brahma Prakash Chair Visiting Professor, Indian Institute of Science, Bangalore (2000)
  • Distinguished Alumni Award from Indian Institute of Science, Bangalore (2000)
  • First Endowed Professor in Packaging at the University of Tokyo (1999)
  • Distinguished Professor Award, Georgia Institute of Technology (1998)
  • Honorary Visiting Professor by Chinese Academy of Sciences to Fudan University (1997)
  • University of Illinois Alumni Honor Award for Distinguished Service in Engineering (1991)
 
Contact Information
Phone: (404) 894-9097
Fax: (404) 894-3842
Email: rao.tummala@ece.gatech.edu

Georgia Institute of Technology
Packaging Research Center
Manufacturing Research Center (MaRC) Building
813 Ferst Drive, Room 351
Mail Code: 0250
Atlanta, GA 30332-0250