Awards,
Honors & Memberships
Professional Society Awards
- IEEE David Feldman Award, IEEE-CPMT Society (2007)
- IEEE EAB Major Educational Innovation Award (2003)
- Member, Academy of Engineering, India (2003)
- Member, Indian National Academy of Engineering (2002)
- Third Millenium Award from IEEE (2000)
- John A. Wagnon’s Award from International Microelectronic And Packaging Society (1998)
- John Jeppson Award from Am Ceramic Society (1997)
- Fellow of International Microelectronic Packaging Society (1997)
- Dan Hughes Award from International Microelectronic And Packaging Society (1997)
- European Electronic Materials Award from DVM (1995)
- IEEE Fellow (1993)
- Member National Academy of Engineering, USA (1993)
- Arthur Friedberg Memorial Award from American Ceramic Society (1993)
- Sustained Technical Achievement Award from IEEE CPMT (1992)
- Engineering Materials Achievement Award from ASM-International (1992)
- David Sarnoff Award for Industry’s first MCM from IEEE (1991)
- Fellow of American Ceramic Society (1986)
- IBM Fellow (1984-1993)
IEEE Best Technical Paper Awards
IEEE CPMT Society awards presented to Prof. Rao Tummala and PRC colleagues.
- Intel Fellowship paper
- Motorola Fellowship paper
- 11 Materials conference papers
- 7 ECTC papers
- EPTC Singapore papers
Industry Awards
- Total Excellence in Electronics Manufacturing (TEEM) Award from Society of Manufacturing Engineers (1997)
- Industry Week’s Award: one of 50 Stars in USA for Improving U.S. Competitiveness (1996)
- 16 Corporate and Invention Awards from IBM
Academic Awards
- Educator of the Year for Excellence in Teaching, Research, and Innovation in the Field of Electronics from the India-America Cultural Association (2002)
- Visiting Professor, City University of Hong Kong (2001)
- Brahma Prakash Chair Visiting Professor, Indian Institute of Science, Bangalore (2000)
- Distinguished Alumni Award from Indian Institute of Science, Bangalore (2000)
- First Endowed Professor in Packaging at the University of Tokyo (1999)
- Distinguished Professor Award, Georgia Institute of Technology (1998)
- Honorary Visiting Professor by Chinese Academy of Sciences to Fudan University (1997)
- University of Illinois Alumni Honor Award for Distinguished Service in Engineering (1991)
Contact Information
Phone: (404) 894-9097
Fax: (404) 894-3842
Email: rao.tummala@ece.gatech.edu
Georgia Institute of Technology
Packaging Research Center
Manufacturing Research Center (MaRC) Building
813 Ferst Drive, Room 351
Mail Code: 0250
Atlanta, GA 30332-0250
